| Characterization of FR-4 printed circuit board laminates before and after exposure to lead-free soldering conditions R Sanapala University of Maryland, College Park, 2008 | 35 | 2008 |
| Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates R Sanapala, B Sood, D Das, M Pecht IEEE Transactions on Electronics Packaging Manufacturing 32 (4), 272-280, 2009 | 33 | 2009 |
| Wafer defect discovery H Chen, K Wu, M Plihal, V Pandita, R Sanapala, V Bhagat, R Lakhawat, ... US Patent 9,518,934, 2016 | 21 | 2016 |
| Comparison of printed circuit board property variations in response to simulated lead-free soldering B Sood, R Sanapala, D Das, M Pecht, CY Huang, MY Tsai IEEE Transactions on Electronics Packaging Manufacturing 33 (2), 98-111, 2010 | 21 | 2010 |
| System and method for dynamic care area generation on an inspection tool V Ramachandran, R Sanapala, V Anantha, P Measor, R Manepalli, ... US Patent 10,018,571, 2018 | 14 | 2018 |
| Improving throughput and image quality of high-resolution 3D X-ray microscopes using deep learning reconstruction techniques H Villarraga-Gómez, MN Rad, M Andrew, A Andreyev, R Sanapala, ... 11th Conference on Industrial Computed Tomography (iCT), 8-11, 2022 | 10 | 2022 |
| Improving scan time and image quality in 3D X-ray microscopy by deep learning reconstruction techniques H Villarraga-Gómez, A Andreyev, M Andrew, H Bale, R Sanapala, ... Proc. 35th ASPE Annual Meeting 75, 361-366, 0 | 7 | |
| Supercharging X-ray microscopy using advanced algorithms M Andrew, R Sanapala, A Andreyev, H Bale, C Hartfield Microscopy and Analysis, 17, 2020 | 6 | 2020 |
| EUV reticle print verification with advanced broadband optical wafer inspection and e-beam review systems R Sanapala, A Cross, M Preil, J Qian, S Suman, V Anantha, K Sah, ... Photomask Technology 2017 10451, 142-148, 2017 | 6 | 2017 |
| Optical mode analysis with design-based care areas B Brauer, R Sanapala US Patent 9,702,827, 2017 | 6 | 2017 |
| New technologies for x-ray microscopy: phase correction and fully automated deep learning based tomographic reconstruction M Andrew, L Omlor, A Andreyev, MS Khoshkhoo, R Sanapala Developments in X-Ray Tomography XIII 11840, 118400I, 2021 | 4 | 2021 |
| Accelerating litho technology development for advanced design node flash memory FEOL by next-generation wafer inspection and SEM review platforms BH Lee, J Ahn, D Ihm, S Chin, DR Lee, S Choi, J Lee, HK Kang, ... Metrology, Inspection, and Process Control for Microlithography XXVI 8324 …, 2012 | 3 | 2012 |
| Wafer Defect Discovery H Chen, K Wu, M Plihal, V Pandita, R Sanapala, V Bhagat, R Lakhawat, ... US Patent App. 15/359,589, 2017 | 2 | 2017 |
| Noise, Sampling, and Phase: Understanding Spurious X-ray Signal WF Stephen Kelly, Matthew Andrew, Andriy Andreyev, Ravikumar Sanapala, Robin ... 6th International Congress on 3D Materials Science (3DMS 2022), 2022 | | 2022 |
| EUV reticle print verification with advanced broadband optical wafer inspection and e-beam review systems D De Simone, R Sanapala, C Andrrew, M Preil, J Qian, S Sumar, ... | | 2017 |
| Advanced Broadband Optical Inspection on Complex Logic Structures using NanoPoint at 28nm Design Nodes Teagle R, Nguyen H, Buengener R, Lin P, Jain A, Kini S, Lakhawat R, and ... International Conference on Frontiers of Characterization and Metrology for …, 2015 | | 2015 |
| Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates Sanapala R, Sood B, Das D, Pecht M, Huang C.Y, Tsai M.Y International Conference on Electronic Materials and Packaging (EMAP 2008 …, 2008 | | 2008 |
