| Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization R Schemmel, V Krieger, T Hemsel, W Sextro 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | 17 | 2020 |
| Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding R Schemmel, T Hemsel, C Dymel, M Hunstig, M Brökelmann, W Sextro Sensors and Actuators A: Physical 295, 653-662, 2019 | 17 | 2019 |
| Validated simulation of the ultrasonic wire bonding process A Unger, R Schemmel, T Meyer, F Eacock, P Eichwald, S Althoff, W Sextro, ... 2016 IEEE CPMT Symposium Japan (ICSJ), 251-254, 2016 | 12 | 2016 |
| Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process C Dymel, P Eichwald, R Schemmel, T Hemsel, M Brökelmann, M Hunstig, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-6, 2018 | 9 | 2018 |
| Effects of different working frequencies on the joint formation in copper wire bonding R Schemmel, S Althoff, W Sextro, A Unger, M Hunstig, M Broekelmann CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 6 | 2018 |
| Multi-dimensional Ultrasonic Copper Bonding–New Challenges for Tool Design P Eichwald, S Althoff, R Schemmel, W Sextro, A Unger, M Brökelmann, ... International Symposium on Microelectronics 2017 (1), 000438-000443, 2017 | 5 | 2017 |
| Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding C Dymel, R Schemmel, T Hemsel, W Sextro, M Brokelmann, M Hunstig 2018 IEEE CPMT Symposium Japan (ICSJ), 41-44, 2018 | 4 | 2018 |
| Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding R Schemmel, C Scheidemann, T Hemsel, O Kirsch, W Sextro CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 3 | 2020 |
| Numerical and experimental investigations in ultrasonic heavy wire bonding R Schemmel, T Hemsel, W Sextro | 3 | 2018 |
| Enhanced process development by simulation of ultrasonic heavy wire bonding R Schemmel Dissertation, Paderborn, Universität Paderborn, 2022, 2022 | 2 | 2022 |
| Experimental parameter identification and validation of a process model for ultrasonic heavy wire bonding R Schemmel, N Müller, L Klahold, T Hemsel, W Sextro 54th International Symposium on Microelectronics 2021 (1), 000346-000355, 2021 | 1 | 2021 |
| Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding R Schemmel, F Eacock, C Dymel, T Hemsel, M Hunstig, M Brökelmann, ... International Symposium on Microelectronics 2019 (1), 000509-000514, 2019 | 1 | 2019 |
| Simulation und Validierung des Bondprozesses A Unger, M Hunstig, R Schemmel Intelligente Herstellung zuverlässiger Kupferbondverbindungen …, 2019 | | 2019 |
| MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall R Schemmel, T Hemsel, W Sextro 43. Deutsche Jahrestagung für Akustik, 2017 | | 2017 |
| MoRFUS mobile Reinigungseinheit für Förderketten basierend auf Ultraschall WS Reinhard Schemmel, Tobias Hemsel DAGA2017 43, 611-614, 2017 | | 2017 |
