| Direct electron microscopy studies of the bone—hydroxylapatite interface BM Tracy, RH Doremus Journal of biomedical materials research 18 (7), 719-726, 1984 | 333 | 1984 |
| Use of fiducial marks for improved blank wafer defect review BM Tracy, DL Wollesen US Patent 5,847,821, 1998 | 35 | 1998 |
| Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device RK Klein, D Erb, S Avanzino, R Cheung, S Luning, B Tracy, S Gupta, ... US Patent 5,770,519, 1998 | 35 | 1998 |
| Specimen preparation for transmission electron microscopy of materials 2 R Anderson Pittsburgh, PA (USA); Materials Research Society, 1990 | 29 | 1990 |
| Apparatus and method to improve electromigration performance by use of amorphous barrier layer IIRC Blish, B Tracy US Patent 5,882,738, 1999 | 27 | 1999 |
| Specimen preparation for transmission electron microscopy of materials III J Benedict, R Anderson, SJ Klepeis, B Tracy, J Bravman MRS Symposium Proceedings, 121-140, 1992 | 27 | 1992 |
| Comparison of mechanical and microstructural properties of hydrogen and silane reduced low pressure chemical vapor deposited tungsten films S Sivaram, MLA Dass, CS Wei, B Tracy, R Shukla Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11 (1 …, 1993 | 18 | 1993 |
| The formation of titanium silicide by arsenic ion beam mixing and rapid thermal annealing RK Shukla, PW Davies, BM Tracy Journal of Vacuum Science & Technology B: Microelectronics Processing and …, 1986 | 18 | 1986 |
| Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device RK Klein, DM Erb, S Avanzino, R Cheung, S Luning, B Tracy, S Gupta, ... US Patent 5,639,691, 1997 | 17 | 1997 |
| Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device RK Klein, DM Erb, S Avanzino, R Cheung, S Luning, B Tracy, S Gupta, ... US Patent 5,639,691, 1997 | 17 | 1997 |
| TEM validation of CD AFM image reconstruction GA Dahlen, L Mininni, M Osborn, HC Liu, JR Osborne, B Tracy, ... Metrology, Inspection, and Process Control for Microlithography XXI 6518, 651818, 2007 | 15 | 2007 |
| Specimen preparation for transmission electron microscopy of materials—III A Barna, R Anderson, B Tracy, J Bravman Materials Research Society, Warrendale, PA 254, 3, 1992 | 15 | 1992 |
| Temperature sensing probe for microthermometry R Alvis, AN Erickson, ARR Kizchery, JD Romero, BM Tracy US Patent 5,713,667, 1998 | 14 | 1998 |
| Semiconductor wafer optical scanning system and method using swath-area defect limitation PJ Steffan, B Tracy, MC Chen US Patent 6,011,619, 2000 | 12 | 2000 |
| Graded Ta/TaN/Ta barrier for copper interconnects for high electromigration resistance T Nogami, YC Joo, S Lopatin, J Romero, J Bernard, W Blum, ... 1998 Advanced Metallization Conference Proc., 120-121, 1998 | 12 | 1998 |
| Specimen Preparation for Transmission Electron Microscopy of Materials-III, eds. R. Anderson, B. Tracy and J. Bravman DP Basile, R Boylan, B Baker, K Hayes, D Soza Mater. Res. Soc. Symp. Proc. 254 23, 1992 | 12 | 1992 |
| Venous thromboembolism prophylaxis in neurosurgical trauma patients BM Tracy, JR Dunne, CM O'Neal, E Clayton Journal of Surgical Research 205 (1), 221-227, 2016 | 11 | 2016 |
| Adopting low-voltage STEM and automated sample prep to perform IC failure analysis B Tracy, K Alberi, S Tabrez Micro 22 (6), 87-+, 2004 | 10 | 2004 |
| Microstructural Science for Thin Film Metallizations in Electronic Applications BM Tracy, PW Davies, D Fanger, P Gartman, J Sanchez, DA Smith, ... by J. Sanchez, DA Smith, and N. DeLanerolle (TMS, 1988), 157, 1988 | 9 | 1988 |
| The effect of metal film topography and lithography on grain size distributions and on electromigration performance YE Strausser, BL Euzent, RC Smith, BM Tracy, K Wu 25th International Reliability Physics Symposium, 140-144, 1987 | 9 | 1987 |
Ehrenfried ZschechProfessor for Nanoanalysis, Technical University DresdenVerified email at ikts.fraunhofer.de
