Eric MacDonald
Cited by
Cited by
3D Printing multifunctionality: structures with electronics
D Espalin, DW Muse, E MacDonald, RB Wicker
The International Journal of Advanced Manufacturing Technology 72 (5-8), 963-978, 2014
3D printing for the rapid prototyping of structural electronics
E Macdonald, R Salas, D Espalin, M Perez, E Aguilera, D Muse, ...
IEEE access 2, 234-242, 2014
Multiprocess 3D printing for increasing component functionality
E MacDonald, R Wicker
Science 353 (6307), 2016
Integrating stereolithography and direct print technologies for 3D structural electronics fabrication
AJ Lopes, E MacDonald, RB Wicker
Rapid Prototyping Journal, 2012
A 32-bit PowerPC system-on-a-chip with support for dynamic voltage scaling and dynamic frequency scaling
KJ Nowka, GD Carpenter, EW MacDonald, HC Ngo, BC Brock, KI Ishii, ...
IEEE Journal of Solid-State Circuits 37 (11), 1441-1447, 2002
Body contacted dynamic memory
E MacDonald, S Mukherjee
US Patent 6,111,778, 2000
Fabrication of barium titanate by binder jetting additive manufacturing technology
SM Gaytan, MA Cadena, H Karim, D Delfin, Y Lin, D Espalin, ...
Ceramics International 41 (5), 6610-6619, 2015
Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices
RB Wicker, F Medina, E MacDonald, DW Muse, D Espalin
US Patent 10,518,490, 2019
Multi-material microstereolithography
JW Choi, E MacDonald, R Wicker
The International Journal of Advanced Manufacturing Technology 49 (5-8), 543-551, 2010
Novel ABS-based binary and ternary polymer blends for material extrusion 3D printing
CR Rocha, ART Perez, DA Roberson, CM Shemelya, E MacDonald, ...
Journal of Materials Research 29 (17), 1859-1866, 2014
3D printing of electro mechanical systems
E Aguilera, J Ramos, D Espalin, F Cedillos, D Muse, R Wicker, ...
Proceedings of the Solid Freeform Fabrication Symposium, 950-961, 2013
Integration of a thermal imaging feedback control system in electron beam melting
E Rodriguez, F Medina, D Espalin, C Terrazas, D Muse, C Henry, ...
WM Keck Center for 3D Innovation, University of Texas at El Paso, 945-961, 2012
Encapsulated copper wire and copper mesh capacitive sensing for 3-D printing applications
C Shemelya, F Cedillos, E Aguilera, D Espalin, D Muse, R Wicker, ...
IEEE Sensors Journal 15 (2), 1280-1286, 2014
3-D printed microwave patch antenna via fused deposition method and ultrasonic wire mesh embedding technique
M Liang, C Shemelya, E MacDonald, R Wicker, H Xin
IEEE Antennas and Wireless Propagation Letters 14, 1346-1349, 2015
Expanding the applicability of FDM-type technologies through materials development
D Roberson, CM Shemelya, E MacDonald, R Wicker
Rapid Prototyping Journal, 2015
The influence of process parameters on vertical surface roughness of the AlSi10Mg parts fabricated by selective laser melting
T Yang, T Liu, W Liao, E MacDonald, H Wei, X Chen, L Jiang
Journal of Materials Processing Technology 266, 26-36, 2019
Multi-material, multi-technology stereolithography
RB Wicker, EW MacDonald
Virtual and Physical Prototyping 7 (3), 181-194, 2012
Microstructural and process characterization of conductive traces printed from Ag particulate inks
DA Roberson, RB Wicker, LE Murr, K Church, E MacDonald
Materials 4 (6), 963-979, 2011
Development of a fused deposition modeling system for low melting temperature metal alloys
J Mireles, HC Kim, I Hwan Lee, D Espalin, F Medina, E MacDonald, ...
Journal of Electronic Packaging 135 (1), 011008, 2013
Ultra low voltage level shifters to interface sub and super threshold reconfigurable logic cells
A Chavan, E MacDonald
2008 IEEE Aerospace Conference, 1-6, 2008
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