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Duane Boning
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Towards Fast Computation of Certified Robustness for ReLU Networks
TW Weng, H Zhang, H Chen, Z Song, CJ Hsieh, D Boning, IS Dhillong, ...
International Conference on Machine Learning (ICML) PMLR 80, 5276-5285, 2018
4882018
Design for manufacturability and statistical design: a constructive approach
M Orshansky, S Nassif, D Boning
Springer Science & Business Media, 2007
2912007
Analysis and decomposition of spatial variation in integrated circuit processes and devices
BE Stine, DS Boning, JE Chung
IEEE Transactions on Semiconductor Manufacturing 10 (1), 24-41, 1997
2851997
Models of process variations in device and interconnect
DS Boning, S Nassif
Design of High Performance Microprocessor Circuits, 98-115, 2000
2512000
The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes
BE Stine, DS Boning, JE Chung, L Camilletti, F Kruppa, ER Equi, W Loh, ...
IEEE Transactions on Electron Devices 45 (3), 665-679, 1998
2501998
Run by run control of chemical-mechanical polishing
DS Boning, WP Moyne, TH Smith, J Moyne, R Telfeyan, A Hurwitz, ...
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
2071996
Characterization and Modeling of Oxide Chemical-Mechanical Polishing Using Planarization Length and Pattern Density Concepts
DO Ouma, DS Boning, JE Chung, WG Easter, V Saxena, S Misra, ...
IEEE Transactions on Semiconductor Manufacturing 15 (2), 232-244, 2002
1652002
Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing
BE Stine, DO Ouma, RR Divecha, DS Boning, JE Chung, DL Hetherington, ...
Semiconductor Manufacturing, IEEE Transactions on 11 (1), 129-140, 1998
1641998
A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance
V Mehrotra, SL Sam, D Boning, A Chandrakasan, R Vallishayee, S Nassif
Proceedings of the 37th Annual Design Automation Conference, 172-175, 2000
1602000
Towards stable and efficient training of verifiably robust neural networks
H Zhang, H Chen, C Xiao, S Gowal, R Stanforth, B Li, D Boning, CJ Hsieh
arXiv preprint arXiv:1906.06316, 2019
1592019
A closed-form analytic model for ILD thickness variation in CMP processes
B Stine, D Ouma, R Divecha, D Boning, J Chung, DL Hetherington, I Ali, ...
Chemical-Mechanical Planarization for ULSI Multilevel Interconnect Confer …, 1997
1391997
A self-tuning EWMA controller utilizing artificial neural network function approximation techniques
TH Smith, DS Boning
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997
1311997
A Self-Tuning EWMA Controller Utilizing Artificial Neural Network Function Approximation Techniques
T Smith, D Boning
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 …, 1996
1311996
DOE/Opt: A system for design of experiments, response surface modeling, and optimization using process and device simulation
DS Boning, PK Mozumder
IEEE Transactions on Semiconductor Manufacturing 7 (2), 233-244, 1994
1201994
Modeling the effects of manufacturing variation on high-speed microprocessor interconnect performance
V Mehrotra, S Nassif, D Boning, J Chung
International Electron Devices Meeting 1998. Technical Digest (Cat. No …, 1998
1121998
An integrated characterization and modeling methodology for CMP dielectric planarization
D Ouma, D Boning, J Chung, G Shin, L Olsen, J Clark
Proceedings of the IEEE 1998 International Interconnect Technology …, 1998
1101998
Technology scaling impact of variation on clock skew and interconnect delay
V Mehrotra, D Boning
Proceedings of the IEEE 2001 International Interconnect Technology …, 2001
932001
The limitations of adversarial training and the blind-spot attack
H Zhang, H Chen, Z Song, D Boning, IS Dhillon, CJ Hsieh
arXiv preprint arXiv:1901.04684, 2019
922019
Run by Run Advanced Process Control of Metal Sputter Deposition
T Smith, D Boning, J Stefani, SW Butler
Proc. of the Second International Symposium on Process Control, Diagnostics …, 1997
851997
Simultaneous fault detection and classification for semiconductor manufacturing tools
BE Goodlin, DS Boning, HH Sawin, BM Wise
Journal of the Electrochemical Society 150 (12), G778, 2003
822003
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Articles 1–20