Qinghuang Lin
Qinghuang Lin
Director, Technology Development Center, ASML US
Verified email at asml.com
Title
Cited by
Cited by
Year
Physical properties of polymers handbook
JE Mark
Springer 1076, 825, 2007
26882007
Modeling line edge roughness effects in sub 100 nanometer gate length devices
P Oldiges, Q Lin, K Petrillo, M Sanchez, M Ieong, M Hargrove
2000 International Conference on Simulation of Semiconductor Processes and …, 2000
1932000
Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
Q Lin, M Angelopoulos, AD Katnani, R Sooriyakumaran
US Patent 6,087,064, 2000
1512000
Patternable low dielectric constant materials and their use in ULSI interconnection
Q Lin, R Sooriyakumaran
US Patent 7,041,748, 2006
1352006
Effect of drawing on structure and properties of a liquid crystalline polymer and polycarbonate insitu composite
Q Lin, J Jho, AF Yee
Polymer Engineering & Science 33 (13), 789-798, 1993
821993
Small angle x-ray scattering metrology for sidewall angle and cross section of nanometer scale line gratings
T Hu, RL Jones, W Wu, EK Lin, Q Lin, D Keane, S Weigand, J Quintana
Journal of Applied Physics 96 (4), 1983-1987, 2004
802004
Airgap-containing interconnect structure with patternable low-k material and method of fabricating
Q Lin
US Patent 8,476,758, 2013
732013
Method for air gap interconnect integration using photo-patternable low k material
LA Clevenger, M Darnon, Q Lin, AD Lisi, SV Nitta
US Patent 8,241,992, 2012
692012
Resist composition and process of forming a patterned resist layer on a substrate
Q Lin, TM Hughes, GM Jordhamo, AD Katnani, WM Moreau, N Patel
US Patent 6,210,856, 2001
692001
Toward controlled resist line-edge roughness: material origin of line-edge roughness in chemically amplified positive-tone resists
Q Lin, R Sooriyakumaran, WS Huang
Advances in Resist Technology and Processing XVII 3999, 230-239, 2000
692000
Measurement of bandgap energies in low-k organosilicates
MT Nichols, W Li, D Pei, GA Antonelli, Q Lin, S Banna, Y Nishi, JL Shohet
Journal of Applied Physics 115 (9), 094105, 2014
642014
Phase transformations of a liquid crystalline epoxy during curing
Q Lin, AF Yee, JD Earls, RE Hefner Jr, HJ Sue
Polymer 35 (12), 2679-2682, 1994
581994
Evolution of structure and properties of a liquid crystalline epoxy during curing
Q Lin, AF Yee, HJ Sue, JD Earls, RE Hefner Jr
Journal of Polymer Science Part B: Polymer Physics 35 (14), 2363-2378, 1997
561997
Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures
RD Allen, PJ Brock, BW Davis, WS Huang, Q Lin, A Nelson, ...
US Patent 7,709,370, 2010
502010
Photopatternable dielectric materials for BEOL applications and methods for use
RD Allen, PJ Brock, BW Davis, Q Lin, RD Miller, A Nelson, ...
US Patent 8,029,971, 2011
482011
Quantifying the stress relaxation modulus of polymer thin films via thermal wrinkling
EP Chan, S Kundu, Q Lin, CM Stafford
ACS applied materials & interfaces 3 (2), 331-338, 2011
482011
A water-castable, water-developable chemically amplified negative-tone resist
Q Lin, T Steinhäusler, L Simpson, M Wilder, DR Medeiros, CG Willson, ...
Chemistry of materials 9 (8), 1725-1730, 1997
481997
Photopatternable dielectric materials for BEOL applications and methods for use
RD Allen, PJ Brock, BW Davis, GJ Dubois, Q Lin, RD Miller, A Nelson, ...
US Patent 7,919,225, 2011
462011
Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
Q Lin, M Angelopoulos, AD Katnani, R Sooriyakumaran
US Patent 6,340,734, 2002
462002
Patternable dielectric film structure with improved lithography and method of fabricating same
Q Lin, DA Neumayer
US Patent 8,618,663, 2013
452013
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