| Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices KO Jeppson, CM Svensson Journal of Applied Physics 48 (5), 2004-2014, 1977 | 952 | 1977 |
| CMOS circuit speed and buffer optimization N Hedenstierna, KO Jeppson IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 1987 | 600 | 1987 |
| Modeling the influence of the transistor gain ratio and the input-to-output coupling capacitance on the CMOS inverter delay KO Jeppson IEEE Journal of Solid-State Circuits 29 (6), 646-654, 1994 | 166 | 1994 |
| Improved heat spreading performance of functionalized graphene in microelectronic device application Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ... Advanced Functional Materials 25 (28), 4430-4435, 2015 | 148 | 2015 |
| Applications of aluminium nitride films deposited by reactive sputtering to silicon-on-insulator materials S Bengtsson, M Bergh, M Choumas, COC Olesen, KOJKO Jeppson Japanese journal of applied physics 35 (8R), 4175, 1996 | 107 | 1996 |
| Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing J Bao, K Jeppson, M Edwards, Y Fu, L Ye, X Lu, J Liu Electronic Materials Letters 12, 1-16, 2016 | 94 | 2016 |
| Through-silicon vias filled with densified and transferred carbon nanotube forests T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu IEEE Electron Device Letters 33 (3), 420-422, 2012 | 87 | 2012 |
| Through silicon vias filled with planarized carbon nanotube bundles T Wang, K Jeppson, N Olofsson, EEB Campbell, J Liu Nanotechnology 20 (48), 485203, 2009 | 77 | 2009 |
| Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ... Journal of Physics D: Applied Physics 49 (26), 265501, 2016 | 58 | 2016 |
| Influence of the channel width on the threshold voltage modulation in MOSFETs KO Jeppson Electronics Letters 11 (14), 297-299, 1975 | 56 | 1975 |
| Dry densification of carbon nanotube bundles T Wang, K Jeppson, J Liu Carbon 48 (13), 3795-3801, 2010 | 52 | 2010 |
| Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ... Nanotechnology 27 (33), 335705, 2016 | 49 | 2016 |
| Vertically stacked carbon nanotube-based interconnects for through silicon via application D Jiang, W Mu, S Chen, Y Fu, K Jeppson, J Liu IEEE Electron Device Letters 36 (5), 499-501, 2015 | 47 | 2015 |
| Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ... Carbon 106, 195-201, 2016 | 41 | 2016 |
| An efficient parameter extraction algorithm for MOS transistor models PR Karlsson, KO Jeppson IEEE transactions on electron devices 39 (9), 2070-2076, 1992 | 39 | 1992 |
| An efficient method for determining threshold voltage, series resistance and effective geometry of MOS transistors PR Karlsson, KO Jeppson IEEE transactions on semiconductor manufacturing 9 (2), 215-222, 1996 | 36 | 1996 |
| A surface potential model for predicting substrate noise coupling in integrated circuits S Kristiansson, F Ingvarson, SP Kagganti, N Simic, M Zgrda, KO Jeppson IEEE journal of solid-state circuits 40 (9), 1797-1803, 2005 | 35 | 2005 |
| Formation of three-dimensional carbon nanotube structures by controllable vapor densification T Wang, D Jiang, S Chen, K Jeppson, L Ye, J Liu Materials Letters 78, 184-187, 2012 | 32 | 2012 |
| The halo algorithm-an algorithm for hierarchical design of rule checking of VLSI circuits N Hedenstierna, KO Jeppson IEEE transactions on computer-aided design of integrated circuits and …, 1993 | 32 | 1993 |
| Compact spreading resistance model for rectangular contacts on uniform and epitaxial substrates S Kristiansson, F Ingvarson, KO Jeppson IEEE transactions on electron devices 54 (9), 2531-2536, 2007 | 30 | 2007 |
Johan LiuProfessor, Chalmers University of TechnologyVerified email at chalmers.se
