Kjell Jeppson
Kjell Jeppson
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Cited by
Cited by
Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices
KO Jeppson, CM Svensson
Journal of Applied Physics 48 (5), 2004-2014, 1977
CMOS circuit speed and buffer optimization
N Hedenstierna, KO Jeppson
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 1987
Modeling the influence of the transistor gain ratio and the input-to-output coupling capacitance on the CMOS inverter delay
KO Jeppson
IEEE Journal of Solid-State Circuits 29 (6), 646-654, 1994
Improved heat spreading performance of functionalized graphene in microelectronic device application
Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ...
Advanced Functional Materials 25 (28), 4430-4435, 2015
Applications of aluminium nitride films deposited by reactive sputtering to silicon-on-insulator materials
S Bengtsson, M Bergh, M Choumas, COC Olesen, KOJKO Jeppson
Japanese journal of applied physics 35 (8R), 4175, 1996
Through-silicon vias filled with densified and transferred carbon nanotube forests
T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu
IEEE Electron Device Letters 33 (3), 420-422, 2012
Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing
J Bao, K Jeppson, M Edwards, Y Fu, L Ye, X Lu, J Liu
Electronic Materials Letters 12, 1-16, 2016
Through silicon vias filled with planarized carbon nanotube bundles
T Wang, K Jeppson, N Olofsson, EEB Campbell, J Liu
Nanotechnology 20 (48), 485203, 2009
Influence of the channel width on the threshold voltage modulation in MOSFETs
KO Jeppson
Electronics Letters 14 (11), 297-299, 1975
Dry densification of carbon nanotube bundles
T Wang, K Jeppson, J Liu
Carbon 48 (13), 3795-3801, 2010
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ...
Journal of Physics D: Applied Physics 49 (26), 265501, 2016
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ...
Nanotechnology 27 (33), 335705, 2016
Vertically stacked carbon nanotube-based interconnects for through silicon via application
D Jiang, W Mu, S Chen, Y Fu, K Jeppson, J Liu
IEEE Electron Device Letters 36 (5), 499-501, 2015
An efficient parameter extraction algorithm for MOS transistor models
PR Karlsson, KO Jeppson
IEEE transactions on electron devices 39 (9), 2070-2076, 1992
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ...
Carbon 106, 195-201, 2016
A surface potential model for predicting substrate noise coupling in integrated circuits
S Kristiansson, F Ingvarson, SP Kagganti, N Simic, M Zgrda, KO Jeppson
IEEE journal of solid-state circuits 40 (9), 1797-1803, 2005
An efficient method for determining threshold voltage, series resistance and effective geometry of MOS transistors
PR Karlsson, KO Jeppson
IEEE transactions on semiconductor manufacturing 9 (2), 215-222, 1996
Formation of three-dimensional carbon nanotube structures by controllable vapor densification
T Wang, D Jiang, S Chen, K Jeppson, L Ye, J Liu
Materials Letters 78, 184-187, 2012
The halo algorithm-an algorithm for hierarchical design of rule checking of VLSI circuits
N Hedenstierna, KO Jeppson
IEEE transactions on computer-aided design of integrated circuits and …, 1993
Compact spreading resistance model for rectangular contacts on uniform and epitaxial substrates
S Kristiansson, F Ingvarson, KO Jeppson
IEEE transactions on electron devices 54 (9), 2531-2536, 2007
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