| Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation E Kim, J Hong, S Hong, C Kanade, H Seok, HU Kim, T Kim Materials Chemistry and Physics 273, 124967, 2021 | 33 | 2021 |
| Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing E Kim, J Lee, C Bae, H Seok, HU Kim, T Kim Powder Technology 397, 117025, 2022 | 31 | 2022 |
| Energy‐Band Engineering by Remote Doping of Self‐Assembled Monolayers Leads to High‐Performance IGZO/p‐Si Heterostructure Photodetectors G Woo, DH Lee, Y Heo, E Kim, S On, T Kim, H Yoo Advanced Materials 34 (6), 2107364, 2022 | 23 | 2022 |
| High‐temperature skin softening materials overcoming the trade‐off between thermal conductivity and thermal contact resistance T Kim, S Kim, E Kim, T Kim, J Cho, C Song, S Baik Small 17 (38), 2102128, 2021 | 17 | 2021 |
| Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing E Kim, J Lee, Y Park, C Shin, J Yang, T Kim Powder technology 381, 451-458, 2021 | 14 | 2021 |
| Tailoring Polymorphic Heterostructures of MoS2–WS2 (1T/1T, 2H/2H) for Efficient Hydrogen Evolution Reaction H Seok, M Kim, J Cho, E Kim, S Son, KW Kim, JK Kim, PJ Yoo, M Kim, ... ACS Sustainable Chemistry & Engineering 11 (2), 568-577, 2023 | 13 | 2023 |
| Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction J Lee, E Kim, C Bae, H Seok, J Cho, K Aydin, T Kim Materials Science in Semiconductor Processing 159, 107349, 2023 | 12 | 2023 |
| Effect of viscosity on ceria abrasive removal during the buff clean process J Kim, S Hong, E Kim, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... ECS Journal of Solid State Science and Technology 9 (8), 084003, 2020 | 10 | 2020 |
| The mechanical effect of soft pad on copper chemical mechanical polishing P Liu, Y Nam, S Lee, E Kim, S Jeon, K Park, S Hong, T Kim Materials Science in Semiconductor Processing 155, 107256, 2023 | 6 | 2023 |
| Activation of nitrogen species mixed with Ar and H2S plasma for directly N-doped TMD films synthesis J Cho, H Seok, I Lee, J Lee, E Kim, D Sung, IK Baek, CH Lee, T Kim Scientific Reports 12 (1), 10335, 2022 | 6 | 2022 |
| Polishing of zirconia ceramics by chemically-induced micro-nano bubbles L Xu, K Park, H Lei, C Yao, V Kanade, E Kim, C Kanade, P Liu, T Kim Ceramics International 48 (12), 17185-17195, 2022 | 6 | 2022 |
| Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing L Xu, P Liu, H Lei, K Park, E Kim, Y Cho, J Lee, S Park, T Kim Precision Engineering 74, 20-35, 2022 | 6 | 2022 |
| Synthesis of vertically aligned wafer-scale tantalum disulfide using high-Ar/H2S ratio plasma H Seok, I Lee, J Cho, D Sung, IK Baek, CH Lee, E Kim, S Jeon, K Park, ... Nanotechnology 33 (2), 025603, 2021 | 6 | 2021 |
| Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing C Shin, A Kulkarni, K Kim, H Kim, S Jeon, E Kim, Y Jin, T Kim The International Journal of Advanced Manufacturing Technology 97, 563-571, 2018 | 6 | 2018 |
| Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments L Xu, K Park, H Lei, P Liu, E Kim, Y Cho, T Kim, C Chen Friction 11 (9), 1624-1640, 2023 | 5 | 2023 |
| Highly penetrant organic solvent-resistant layer-by-layer assembled ultra-thin barrier coating for confined microchannel devices S Hong, SS Yoo, GH Choi, JH Lee, YW Choi, M Kim, E Kim, SJ Kwon, ... Composites Part B: Engineering 230, 109537, 2022 | 5 | 2022 |
| Photo-oxidative degradation of polyacids derived ceria nanoparticle modulation for chemical mechanical polishing E Kim, J Hong, H Seok, T Kim Scientific Reports 12 (1), 1613, 2022 | 5 | 2022 |
| In-situ monitoring hydrodynamic pressure distribution during chemical mechanical polishing E Kim, G Woo, T Kim 2019 II Workshop on Metrology for Industry 4.0 and IoT (MetroInd4. 0&IoT …, 2019 | 4 | 2019 |
| Development of novel multi-selective slurry with mechanically driven etching for through silicon via chemical mechanical polishing E Kim, S Choi, S Jeon, H Seok, J Cho, D Shin, T Kim Materials Science in Semiconductor Processing 152, 107025, 2022 | 3 | 2022 |
| Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning J Lee, H Seo, SH Park, E Kim, J Lee, P Liu, S Jeon, S Hong, T Kim Materials Science in Semiconductor Processing 145, 106618, 2022 | 3 | 2022 |
