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Co-authors
Yang LuDept of Mechanical Engineering, the University of Hong KongVerified email at hku.hk- Chaoqun Dang （党超群）Zhejiang UniversityVerified email at zju.edu.cn
- Xiaocui LICity University of Hong KongVerified email at my.cityu.edu.hk
- Hongti ZhangSchool of Physical Science and Technology, ShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Shijun Zhao (趙仕俊)City University of Hong KongVerified email at cityu.edu.hk
- Jingzhuo ZhouCity University of Hong KongVerified email at my.cityu.edu.hk
- Ying HANPennsylvania State UniversityVerified email at psu.edu
- Ke CaoXidian University, Xi’an, ChinaVerified email at xidian.edu.cn
- Libo GaoXiamen University, Xiamen, ChinaVerified email at xmu.edu.cn
- Sufeng FANZhengzhou UniversityVerified email at zzu.edu.cn
- Yang ZhangYanshan University Shaanxi University of TechnologyVerified email at ysu.edu.cn
- Weitong LinCity University of Hong KongVerified email at my.cityu.edu.hk
- Hong WuChongqing University of Posts and TelecommunicationsVerified email at cqupt.edu.cn
- Xiaobin FengWuhan University of TechnologyVerified email at whut.edu.cn
