Y C Chan
Y C Chan
ยืนยันอีเมลแล้วที่ cityu.edu.hk - หน้าแรก
ชื่อ
อ้างโดย
อ้างโดย
ปี
A penalty formulation and numerical approximation of the Reynolds-Hertz problem of elastohydrodynamic lubrication
SR Wu
International Journal of Engineering Science 24 (6), 1001-1013, 1986
234*1986
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
YC Chan, D Yang
Progress in Materials Science 55 (5), 428-475, 2010
2302010
Research advances in nano-composite solders
J Shen, YC Chan
Microelectronics Reliability 49 (3), 223-234, 2009
2132009
Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
YC Chan, ACK So, JKL Lai
Materials Science and Engineering: B 55 (1-2), 5-13, 1998
1981998
Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
PL Tu, YC Chan, JKL Lai
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997
1961997
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure
YC Chan, DY Luk
Microelectronics Reliability 42 (8), 1195-1204, 2002
1792002
Growth kinetics of intermetallic compounds in chip scale package solder joint
PL Tu, YC Chan, KC Hung, JKL Lai
Scripta materialia 44 (2), 317-323, 2001
1492001
Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder
MN Islam, YC Chan, MJ Rizvi, W Jillek
Journal of Alloys and compounds 400 (1-2), 136-144, 2005
1462005
Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder
RA Islam, BY Wu, MO Alam, YC Chan, W Jillek
Journal of alloys and compounds 392 (1-2), 149-158, 2005
1362005
Reliability study of the electroless Ni–P layer against solder alloy
MO Alam, YC Chan, KC Hung
Microelectronics Reliability 42 (7), 1065-1073, 2002
1342002
Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni (P)/Cu bond pad
MO Alam, YC Chan, KN Tu
Journal of Applied Physics 94 (6), 4108-4115, 2003
1282003
Reliability studies of surface mount solder joints-effect of Cu-Sn intermetallic compounds
ACK So, YC Chan
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
1221996
Carrier transport in thin films of organic electroluminescent materials
Z Deng, ST Lee, DP Webb, YC Chan, WA Gambling
Synthetic metals 107 (2), 107-109, 1999
1171999
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film
MA Uddin, MO Alam, YC Chan, HP Chan
Microelectronics Reliability 44 (3), 505-514, 2004
1142004
A review of biomechanical models
AI King
Journal of Biomechanical Engineering 106 (2), 97-104, 1984
1101984
Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging
MN Islam, A Sharif, YC Chan
Journal of electronic materials 34 (2), 143-149, 2005
1082005
Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
AK Gain, YC Chan, WKC Yung
Microelectronics Reliability 51 (5), 975-984, 2011
1012011
Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction
J Shen, YC Chan, SY Liu
Acta Materialia 57 (17), 5196-5206, 2009
972009
Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films
QY Tang, YC Chan, K Zhang
Sensors and Actuators B: Chemical 152 (1), 99-106, 2011
962011
Effect of 0.5 wt% Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization
MO Alam, YC Chan, KN Tu
Journal of Applied Physics 94 (12), 7904-7909, 2003
962003
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บทความ 1–20