Nelson Felix
Nelson Felix
cornell university
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
N Loubet, T Hook, P Montanini, CW Yeung, S Kanakasabapathy, ...
2017 Symposium on VLSI Technology, T230-T231, 2017
2222017
Molecular glass resists for high-resolution patterning
J Dai, SW Chang, A Hamad, D Yang, N Felix, CK Ober
Chemistry of materials 18 (15), 3404-3411, 2006
1292006
Sub-50 nm feature sizes using positive tone molecular glass resists for EUV lithography
SW Chang, R Ayothi, D Bratton, D Yang, N Felix, HB Cao, H Deng, ...
Journal of Materials Chemistry 16 (15), 1470-1474, 2006
962006
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
R Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ...
2016 IEEE International Electron Devices Meeting (IEDM), 2.7. 1-2.7. 4, 2016
902016
Molecular Glass Resists as High‐Resolution Patterning Materials
A De Silva, NM Felix, CK Ober
Advanced Materials 20 (17), 3355-3361, 2008
742008
Study of the Structure− Properties Relationship of Phenolic Molecular Glass Resists for Next Generation Photolithography
A De Silva, JK Lee, X André, NM Felix, HB Cao, H Deng, CK Ober
Chemistry of Materials 20 (4), 1606-1613, 2008
582008
High‐Resolution Patterning of Molecular Glasses Using Supercritical Carbon Dioxide
NM Felix, K Tsuchiya, CK Ober
Advanced materials 18 (4), 442-446, 2006
572006
Phenolic molecular glasses as resists for next-generation lithography
X André, JK Lee, A De Silva, N Felix, CK Ober, HB Cao, H Deng, H Kudo, ...
Advances in Resist Materials and Processing Technology XXIV 6519, 65194B, 2007
412007
Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress
TA Brunner, VC Menon, CW Wong, O Gluschenkov, MP Belyansky, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 12 (4), 043002, 2013
402013
Lithography based on molecular glasses
K Tsuchiya, SW Chang, NM Felix, M Ueda, CK Ober
Journal of Photopolymer Science and Technology 18 (3), 431-434, 2005
392005
Towards all-dry lithography: Electron-beam patternable poly (glycidyl methacrylate) thin films from hot filament chemical vapor deposition
Y Mao, NM Felix, PT Nguyen, CK Ober, KK Gleason
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2004
392004
Materials for future lithography
SW Chang, D Yang, J Dai, N Felix, D Bratton, K Tsuchiya, YJ Kwark, ...
Advances in Resist Technology and Processing XXII 5753, 1-9, 2005
372005
Materials for future lithography
SW Chang, D Yang, J Dai, N Felix, D Bratton, K Tsuchiya, YJ Kwark, ...
Advances in Resist Technology and Processing XXII 5753, 1-9, 2005
372005
FINFET technology featuring high mobility SiGe channel for 10nm and beyond
D Guo, G Karve, G Tsutsui, KY Lim, R Robison, T Hook, R Vega, D Liu, ...
2016 IEEE Symposium on VLSI Technology, 1-2, 2016
352016
EUV patterning successes and frontiers
N Felix, D Corliss, K Petrillo, N Saulnier, Y Xu, L Meli, H Tang, A De Silva, ...
Extreme Ultraviolet (EUV) Lithography VII 9776, 97761O, 2016
332016
Molecular glass resists for next generation lithography
D Bratton, R Ayothi, N Felix, H Cao, H Deng, CK Ober
Advances in Resist Technology and Processing XXIII 6153, 61531D, 2006
302006
Physical vapor deposition of molecular glass photoresists: a new route to chemically amplified patterning
F Pfeiffer, NM Felix, C Neuber, CK Ober, HW Schmidt
Advanced Functional Materials 17 (14), 2336-2342, 2007
282007
Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond
CC Liu, E Franke, Y Mignot, R Xie, CW Yeung, J Zhang, C Chi, C Zhang, ...
Nature Electronics 1 (10), 562-569, 2018
272018
Calix [4] resorcinarene Derivatives as High‐Resolution Resist Materials for Supercritical CO2 Processing
NM Felix, A De Silva, CK Ober
Advanced Materials 20 (7), 1303-1309, 2008
242008
Comparison of left and right side line edge roughness in lithography
L Sun, N Saulnier, G Beique, E Verduijn, W Wang, Y Xu, H Tang, Y Chen, ...
Metrology, Inspection, and Process Control for Microlithography XXX 9778, 977822, 2016
222016
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