| Optimal die placement for interposer-based 3D ICs S Osmolovskyi, J Knechtel, IL Markov, J Lienig 2018 23rd Asia and South Pacific design automation conference (ASP-DAC), 513-520, 2018 | 19 | 2018 |
| Reliability assessment of discrete passive components embedded into PCB core R Schwerz, M Röllig, S Osmolovskyi, KJ Wolter 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 7 | 2014 |
| Physical design challenges and solutions for interposer-based 3D systems S Osmolovskyi, J Lienig Reliability by Design; 9. ITG/GMM/GI-Symposium, 1-8, 2017 | 4 | 2017 |
| Parameters of the manufacturing process and reliability of embedded components S Osmolovskyi, R Schwerz, KJ Wolter Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | 2 | 2013 |
| 3D-Floorplanning für hochparallele Verbindungsstrukturen J Knechtel, J Lienig, S Osmolovskyi | | |
Jens LienigTU DresdenBestätigte E-Mail-Adresse bei ifte.de
