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Sergii Osmolovskyi
Sergii Osmolovskyi
TU Dresden
Verified email at ifte.de - Homepage
Title
Cited by
Cited by
Year
Optimal die placement for interposer-based 3D ICs
S Osmolovskyi, J Knechtel, IL Markov, J Lienig
2018 23rd Asia and South Pacific design automation conference (ASP-DAC), 513-520, 2018
182018
Reliability assessment of discrete passive components embedded into PCB core
R Schwerz, M Röllig, S Osmolovskyi, KJ Wolter
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014
72014
Physical design challenges and solutions for interposer-based 3D systems
S Osmolovskyi, J Lienig
Reliability by Design; 9. ITG/GMM/GI-Symposium, 1-8, 2017
42017
Parameters of the manufacturing process and reliability of embedded components
S Osmolovskyi, R Schwerz, KJ Wolter
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
22013
3D-Floorplanning für hochparallele Verbindungsstrukturen
J Knechtel, J Lienig, S Osmolovskyi
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Articles 1–5