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Jungwon LeeExecutive Vice President, SamsungVerified email at samsung.com
Hessam MahdavifarNortheastern UniversityVerified email at northeastern.edu
Arvind YedlaTexas A&M University, Samsung US R&D CenterVerified email at ssi.samsung.com
Jinhong WuSamsung Semiconductor, Inc., Modem Systems R&DVerified email at ieee.org
Larry DavisProfessor of Computer Science, University of MarylandVerified email at cs.umd.edu
Mohammed FarragCollage of Engineering King Khalid University and Assiut UniversityVerified email at aun.edu.eg
Keke LiuResearch Engineer in Avago TechnologiesVerified email at ucdavis.edu
Hany S. HusseinKing Khalid University, and Associate Professor at Aswan UniversityVerified email at aswu.edu.eg
roberto garelloPolitecnico di TorinoVerified email at polito.it
Mahmoud M. SelimAssociate Professor, Tanta UniversityVerified email at f-eng.tanta.edu.eg
Mohamed RihanDepartment of Communications Engineering, University of Bremen, IEEE Senior MemberVerified email at ant.uni-bremen.de
Mostafa MedraWireless system engineer, HuaweiVerified email at ieee.org
Masoud AlghoniemyUniversity of AlexandriaVerified email at alexu.edu.eg
Mohamed ElwekeilFaculty of Electronic Engineering, Menoufia UniversityVerified email at el-eng.menofia.edu.eg
Jonathan HarelCalifornia Institute of TechnologyVerified email at klab.caltech.edu
Khaled ElsayedProfessor of Communication Networks and Systems, Cairo UniversityVerified email at cu.edu.eg
Alexander VardyUniversity of California San DiegoVerified email at ucsd.edu
Daniel AugotINRIA et LIXVerified email at inria.fr
Onsy Abdel AlimBeirut Arab University, Lebanon / Alexandria University, EgyptVerified email at bau.edu.lb
Adel BarakatKyushu UniversityVerified email at ed.kyushu-u.ac.jp