| Capacitance-voltage characterization of interfaces G Brammertz, HC Lin, K Martens, D Mercier, S Sioncke, A Delabie, ... Applied Physics Letters 93 (18), 183504, 2008 | 132 | 2008 |
| Fabrication and characterisation of 200mm germanium-on-insulator (GeOI) substrates made from bulk germanium C Deguet, L Sanchez, T Akatsu, F Allibert, J Dechamp, F Madeira, ... Electronics Letters 42 (7), 1, 2006 | 92 | 2006 |
| Capacitance–voltage characterization of GaAs–oxide interfaces G Brammertz, HC Lin, K Martens, D Mercier, C Merckling, J Penaud, ... Journal of the Electrochemical Society 155 (12), H945, 2008 | 81 | 2008 |
| Quantifying deformation processes near grain boundaries in α titanium using nanoindentation and crystal plasticity modeling MAC Y. Su, C. Zambaldi, D. Mercier, P. Eisenlohr, T.R. Bieler International Journal of Plasticity, 2016 | 38 | 2016 |
| Investigation of Cr (N)/DLC multilayer coatings elaborated by PVD for high wear resistance and low friction applications FD Duminica, R Belchi, L Libralesso, D Mercier Surface and Coatings Technology 337, 396-403, 2018 | 26 | 2018 |
| Investigation of the fracture of very thin amorphous alumina film during spherical nanoindentation D Mercier, V Mandrillon, G Parry, M Verdier, R Estevez, Y Bréchet, ... Thin Solid Film 638, 34-47, 2017 | 19 | 2017 |
| A Matlab toolbox to analyze slip transfer through grain boundaries D Mercier, C Zambaldi, TR Bieler 17th International Conference on Textures of Materials (ICOTOM 17) 82 (1), 2015 | 16 | 2015 |
| Microstructural and mechanical characterisation of electroplated nickel matrix composite coatings D Mercier, JF Vanhumbeeck, M Caruso, XV Eynde, M Febvre Surface Engineering 35 (2), 177-188, 2019 | 11 | 2019 |
| Quantitative evolution of electrical contact resistance between aluminum thin films D Mercier, V Mandrillon, A Holtz, F Volpi, M Verdier, Y Bréchet 2012 IEEE 58th Holm Conference on Electrical Contacts (Holm), 1-8, 2012 | 11 | 2012 |
| Mesure de module d’Young d’un film mince à partir de mesures expérimentales de nanoindentation réalisées sur des systèmes multicouches D Mercier, V Mandrillon, M Verdier, Y Brechet Materiaux et Techniques 99 (2), 169-78, 2011 | 11 | 2011 |
| 200 mm silicon on porous layer substrates made by the smart cut technology for double layer-transfer applications AS Stragier, T Signamarcheix, T Salvetat, E Nolot, J Dechamp, D Mercier, ... Journal of The Electrochemical Society 158 (5), H595, 2011 | 10 | 2011 |
| On the Effect of Q&P Processing on the Stretch-flange-formability of 0.2 C Ultra-high Strength Steel Sheets P Huyghe, S Dépinoy, M Caruso, D Mercier, C Georges, L Malet, S Godet ISIJ international 58 (7), 1341-1350, 2018 | 6 | 2018 |
| Mechanical characterization by multiscale instrumented indentation of highly heterogeneous materials for braking applications S Kossman, A Iost, D Chicot, D Mercier, I Serrano-Muñoz, F Roudet, ... Journal of Materials Science 54 (6), 4647-4670, 2019 | 4 | 2019 |
| Caractérisation mécanique par nanoindentation d’un revêtement composite à matrice nickel électrodéposé D Mercier, JF Vanhumbeeck, M Caruso, X Vanden Eynde Matériaux & Techniques 105 (1), 106, 2017 | 4 | 2017 |
| Analysis of electrical contact resistance establishment between a Ni micro-insert and an Al thin film in flip chip applications D Mercier, V Mandrillon, M Verdier, Y Bréchet, F Volpi, R Estevez, ... Communication poster à la Conférence “Materials for Advanced Metallization, 2012 | 4 | 2012 |
| Capacitance-Voltage (CV) Characterization of GaAs-Oxide Interfaces G Brammertz, HC Lin, K Martens, D Mercier, C Merckling, J Penaud, ... ECS Transactions 16 (5), 507, 2008 | 2 | 2008 |
| Mechanical properties and decohesion of sol–gel coatings on metallic and glass substrates D Mercier, A Nicolay, A Boudiba, XV Eynde, L Libralesso, A Daniel, ... Journal of Sol-Gel Science and Technology 93 (2), 229-243, 2020 | 1 | 2020 |
| PopIn Documentation D Mercier http://popin.readthedocs.io/en/latest/, 2016 | 1 | 2016 |
| Investigation of the texture and microstructure evolution around a nanoindent close to an individual grain boundary D Mercier, C Zambaldi, P Eisenlohr, Y Su, MA Crimp, TR Bieler ICOTOM17, 2014 | 1 | 2014 |
| Lois de comportement des matériaux utilisés dans les contacts électriques pour application " flip chip " D Mercier Université de Grenoble, 2013 | 1 | 2013 |
Thomas R. BielerMichigan State UniversityVerified email at egr.msu.edu
