David Mercier
Title
Cited by
Cited by
Year
Capacitance-voltage characterization of interfaces
G Brammertz, HC Lin, K Martens, D Mercier, S Sioncke, A Delabie, ...
Applied Physics Letters 93 (18), 183504, 2008
1312008
Fabrication and characterisation of 200mm germanium-on-insulator (GeOI) substrates made from bulk germanium
C Deguet, L Sanchez, T Akatsu, F Allibert, J Dechamp, F Madeira, ...
Electronics Letters 42 (7), 1, 2006
902006
Capacitance–voltage characterization of GaAs–oxide interfaces
G Brammertz, HC Lin, K Martens, D Mercier, C Merckling, J Penaud, ...
Journal of the Electrochemical Society 155 (12), H945, 2008
812008
Quantifying deformation processes near grain boundaries in α titanium using nanoindentation and crystal plasticity modeling
MAC Y. Su, C. Zambaldi, D. Mercier, P. Eisenlohr, T.R. Bieler
International Journal of Plasticity, 2016
372016
Investigation of Cr (N)/DLC multilayer coatings elaborated by PVD for high wear resistance and low friction applications
FD Duminica, R Belchi, L Libralesso, D Mercier
Surface and Coatings Technology 337, 396-403, 2018
212018
Investigation of the fracture of very thin amorphous alumina film during spherical nanoindentation
D Mercier, V Mandrillon, G Parry, M Verdier, R Estevez, Y Bréchet, ...
Thin Solid Film 638, 34-47, 2017
182017
A Matlab toolbox to analyze slip transfer through grain boundaries
D Mercier, C Zambaldi, TR Bieler
17th International Conference on Textures of Materials (ICOTOM 17) 82 (1), 2015
162015
Quantitative evolution of electrical contact resistance between aluminum thin films
D Mercier, V Mandrillon, A Holtz, F Volpi, M Verdier, Y Bréchet
2012 IEEE 58th Holm Conference on Electrical Contacts (Holm), 1-8, 2012
112012
Mesure de module d’Young d’un film mince à partir de mesures expérimentales de nanoindentation réalisées sur des systèmes multicouches
D Mercier, V Mandrillon, M Verdier, Y Brechet
Materiaux et Techniques 99 (2), 169-78, 2011
112011
Microstructural and mechanical characterisation of electroplated nickel matrix composite coatings
D Mercier, JF Vanhumbeeck, M Caruso, XV Eynde, M Febvre
Surface Engineering 35 (2), 177-188, 2019
102019
200 mm silicon on porous layer substrates made by the smart cut technology for double layer-transfer applications
AS Stragier, T Signamarcheix, T Salvetat, E Nolot, J Dechamp, D Mercier, ...
Journal of The Electrochemical Society 158 (5), H595, 2011
102011
On the Effect of Q&P Processing on the Stretch-flange-formability of 0.2 C Ultra-high Strength Steel Sheets
P Huyghe, S Dépinoy, M Caruso, D Mercier, C Georges, L Malet, S Godet
ISIJ international 58 (7), 1341-1350, 2018
52018
Mechanical characterization by multiscale instrumented indentation of highly heterogeneous materials for braking applications
S Kossman, A Iost, D Chicot, D Mercier, I Serrano-Muñoz, F Roudet, ...
Journal of Materials Science 54 (6), 4647-4670, 2019
42019
Caractérisation mécanique par nanoindentation d’un revêtement composite à matrice nickel électrodéposé
D Mercier, JF Vanhumbeeck, M Caruso, X Vanden Eynde
Matériaux & Techniques 105 (1), 106, 2017
42017
Analysis of electrical contact resistance establishment between a Ni micro-insert and an Al thin film in flip chip applications
D Mercier, V Mandrillon, M Verdier, Y Bréchet, F Volpi, R Estevez, ...
Communication poster à la Conférence “Materials for Advanced Metallization, 2012
42012
Capacitance-Voltage (CV) Characterization of GaAs-Oxide Interfaces
G Brammertz, HC Lin, K Martens, D Mercier, C Merckling, J Penaud, ...
ECS Transactions 16 (5), 507, 2008
22008
Mechanical properties and decohesion of sol–gel coatings on metallic and glass substrates
D Mercier, A Nicolay, A Boudiba, XV Eynde, L Libralesso, A Daniel, ...
Journal of Sol-Gel Science and Technology 93 (2), 229-243, 2020
12020
PopIn Documentation
D Mercier
http://popin.readthedocs.io/en/latest/, 2016
12016
Investigation of the texture and microstructure evolution around a nanoindent close to an individual grain boundary
D Mercier, C Zambaldi, P Eisenlohr, Y Su, MA Crimp, TR Bieler
ICOTOM17, 2014
12014
Lois de comportement des matériaux utilisés dans les contacts électriques pour application " flip chip "
D Mercier
Université de Grenoble, 2013
12013
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Articles 1–20