David Mercier
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Capacitance-voltage characterization of GaAs–Al2O3 interfaces
G Brammertz, HC Lin, K Martens, D Mercier, S Sioncke, A Delabie, ...
Applied Physics Letters 93 (18), 2008
Fabrication and characterisation of 200mm germanium-on-insulator (GeOI) substrates made from bulk germanium
C Deguet, L Sanchez, T Akatsu, F Allibert, J Dechamp, F Madeira, ...
Electronics Letters 42 (7), 1, 2006
Capacitance–voltage characterization of GaAs–oxide interfaces
G Brammertz, HC Lin, K Martens, D Mercier, C Merckling, J Penaud, ...
Journal of the Electrochemical Society 155 (12), H945, 2008
Investigation of Cr (N)/DLC multilayer coatings elaborated by PVD for high wear resistance and low friction applications
FD Duminica, R Belchi, L Libralesso, D Mercier
Surface and Coatings Technology 337, 396-403, 2018
Quantifying deformation processes near grain boundaries in α titanium using nanoindentation and crystal plasticity modeling
MAC Y. Su, C. Zambaldi, D. Mercier, P. Eisenlohr, T.R. Bieler
International Journal of Plasticity, 2016
Investigation of the fracture of very thin amorphous alumina film during spherical nanoindentation
D Mercier, V Mandrillon, G Parry, M Verdier, R Estevez, Y Bréchet, ...
Thin Solid Film 638, 34-47, 2017
A Matlab toolbox to analyze slip transfer through grain boundaries
D Mercier, C Zambaldi, TR Bieler
17th International Conference on Textures of Materials (ICOTOM 17) 82 (1), 2015
Microstructural and mechanical characterisation of electroplated nickel matrix composite coatings
D Mercier, JF Vanhumbeeck, M Caruso, XV Eynde, M Febvre
Surface Engineering 35 (2), 177-188, 2019
On the effect of Q&P processing on the stretch-flange-formability of 0.2 C ultra-high strength steel sheets
P Huyghe, S Dépinoy, M Caruso, D Mercier, C Georges, L Malet, S Godet
ISIJ international 58 (7), 1341-1350, 2018
Quantitative mapping of high modulus materials at the nanoscale: comparative study between atomic force microscopy and nanoindentation
R Coq Germanicus, D Mercier, F Agrebi, M Febvre, D Mariolle, ...
Journal of Microscopy 280 (1), 51-62, 2020
Quantitative evolution of electrical contact resistance between aluminum thin films
D Mercier, V Mandrillon, A Holtz, F Volpi, M Verdier, Y Bréchet
2012 IEEE 58th Holm Conference on Electrical Contacts (Holm), 1-8, 2012
Determination of the Young's Modulus of a TiN Thin Film by Nanoindentation: Analytical Models and FEM Simulation
H Isselé, D Mercier, G Parry, R Estevez, L Vignoud, C Olagnon
e-Journal of Surface Science and Nanotechnology 10 (0), 624-629, 2012
Mesure de module d’Young d’un film mince à partir de mesures expérimentales de nanoindentation réalisées sur des systèmes multicouches
D Mercier, V Mandrillon, M Verdier, Y Brechet
Materiaux et Techniques 99 (2), 169-78, 2011
Mechanical properties and decohesion of sol–gel coatings on metallic and glass substrates
D Mercier, A Nicolay, A Boudiba, X Vanden Eynde, L Libralesso, A Daniel, ...
Journal of Sol-Gel Science and Technology 93, 229-243, 2020
Capacitance-voltage (CV) characterization of GaAs-oxide interfaces
G Brammertz, HC Lin, K Martens, D Mercier, C Merckling, J Penaud, ...
ECS Transactions 16 (5), 507, 2008
Evaluation of adhesion properties of hard coatings by means of indentation and acoustic emission
P Drobný, D Mercier, V Koula, SI Škrobáková, Ľ Čaplovič, M Sahul
Coatings 11 (8), 919, 2021
Mechanical characterization by multiscale instrumented indentation of highly heterogeneous materials for braking applications
S Kossman, A Iost, D Chicot, D Mercier, I Serrano-Muñoz, F Roudet, ...
Journal of materials science 54 (6), 4647-4670, 2019
200 mm silicon on porous layer substrates made by the smart cut technology for double layer-transfer applications
AS Stragier, T Signamarcheix, T Salvetat, E Nolot, J Dechamp, D Mercier, ...
Journal of The Electrochemical Society 158 (5), H595, 2011
Caractérisation mécanique par nanoindentation d’un revêtement composite à matrice nickel électrodéposé
D Mercier, JF Vanhumbeeck, M Caruso, X Vanden Eynde
Matériaux & Techniques 105 (1), 106, 2017
Analysis of electrical contact resistance establishment between a Ni micro-insert and an Al thin film in flip chip applications
D Mercier, V Mandrillon, M Verdier, Y Brechet, F Volpi, R Estevez, ...
Communication poster à la Conférence “Materials for Advanced Metallization, 2012
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