| Quasiparticle interaction in liquid 3He S Babu, GE Brown Annals of Physics 78 (1), 1-38, 1973 | 307 | 1973 |
| Excimer laser etching of polymers V Srinivasan, MA Smrtic, SV Babu Journal of applied physics 59 (11), 3861-3867, 1986 | 267 | 1986 |
| Modification of the Preston equation for the chemical–mechanical polishing of copper Q Luo, S Ramarajan, SV Babu Thin solid films 335 (1-2), 160-167, 1998 | 207 | 1998 |
| Hydroxyl Radical Formation in H 2 O 2‐Amino Acid Mixtures and Chemical Mechanical Polishing of Copper M Hariharaputhiran, J Zhang, S Ramarajan, JJ Keleher, Y Li, SV Babu Journal of The Electrochemical Society 147 (10), 3820, 2000 | 140 | 2000 |
| Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria SH Lee, Z Lu, SV Babu, E Matijević Journal of materials Research 17 (10), 2744-2749, 2002 | 139 | 2002 |
| Chemical–mechanical polishing of copper in alkaline media Q Luo, DR Campbell, SV Babu Thin Solid Films 311 (1-2), 177-182, 1997 | 136 | 1997 |
| Effect of pH on CMP of copper and tantalum A Jindal, SV Babu Journal of the Electrochemical Society 151 (10), G709, 2004 | 102 | 2004 |
| Colloid aspects of chemical–mechanical planarization E Matijević, SV Babu Journal of colloid and interface science 320 (1), 219-237, 2008 | 101 | 2008 |
| Achievement of high planarization efficiency in CMP of copper at a reduced down pressure S Pandija, D Roy, SV Babu Microelectronic Engineering 86 (3), 367-373, 2009 | 95 | 2009 |
| Copper dissolution in aqueous ammonia-containing media during chemical mechanical polishing Q Luo, RA Mackay, SV Babu Chemistry of materials 9 (10), 2101-2106, 1997 | 94 | 1997 |
| Metallized plastics 2: fundamental and applied aspects KL Mittal Springer Science & Business Media, 2013 | 91 | 2013 |
| Relative roles of H 2 O 2 and glycine in CMP of copper studied with impedance spectroscopy J Lu, JE Garland, CM Pettit, SV Babu, D Roy Journal of The Electrochemical Society 151 (10), G717, 2004 | 89 | 2004 |
| Stabilization of Alumina Slurry for Chemical− Mechanical Polishing of Copper Q Luo, DR Campbell, SV Babu Langmuir 12 (15), 3563-3566, 1996 | 87 | 1996 |
| Excimer laser induced ablation of polyetheretherketone, polyimide, and polytetrafluoroethylene SV Babu, GC D’couto, FD Egitto Journal of applied physics 72 (2), 692-698, 1992 | 84 | 1992 |
| Citric acid as a complexing agent in CMP of copper: Investigation of surface reactions using impedance spectroscopy VRK Gorantla, KA Assiongbon, SV Babu, D Roy Journal of the Electrochemical Society 152 (5), G404, 2005 | 83 | 2005 |
| Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper Y Hong, VK Devarapalli, D Roy, SV Babu Journal of The Electrochemical Society 154 (6), H444, 2007 | 80 | 2007 |
| Chemical mechanical polishing using mixed abrasive slurries A Jindal, S Hegde, SV Babu Electrochemical and Solid State Letters 5 (7), G48, 2002 | 77 | 2002 |
| Reactive ion etching of monocrystalline, polycrystalline, and amorphous silicon carbide in CF4/O2 mixtures R Padiyath, RL Wright, MI Chaudhry, SV Babu Applied physics letters 58 (10), 1053-1055, 1991 | 75 | 1991 |
| Chemical–mechanical polishing of copper and tantalum with silica abrasives Y Li, M Hariharaputhiran, SV Babu Journal of Materials Research 16 (4), 1066-1073, 2001 | 74 | 2001 |
| Advances in chemical mechanical planarization (CMP) S Babu Elsevier, 2016 | 71 | 2016 |
