S.V. Babu
S.V. Babu
Verified email at clarkson.edu
Cited by
Cited by
Quasiparticle interaction in liquid 3He
S Babu, GE Brown
Annals of Physics 78 (1), 1-38, 1973
Excimer laser etching of polymers
V Srinivasan, MA Smrtic, SV Babu
Journal of applied physics 59 (11), 3861-3867, 1986
Modification of the Preston equation for the chemical–mechanical polishing of copper
Q Luo, S Ramarajan, SV Babu
Thin solid films 335 (1-2), 160-167, 1998
Hydroxyl Radical Formation in H 2 O 2‐Amino Acid Mixtures and Chemical Mechanical Polishing of Copper
M Hariharaputhiran, J Zhang, S Ramarajan, JJ Keleher, Y Li, SV Babu
Journal of The Electrochemical Society 147 (10), 3820, 2000
Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria
SH Lee, Z Lu, SV Babu, E Matijević
Journal of materials Research 17 (10), 2744-2749, 2002
Chemical–mechanical polishing of copper in alkaline media
Q Luo, DR Campbell, SV Babu
Thin Solid Films 311 (1-2), 177-182, 1997
Effect of pH on CMP of copper and tantalum
A Jindal, SV Babu
Journal of the Electrochemical Society 151 (10), G709, 2004
Colloid aspects of chemical–mechanical planarization
E Matijević, SV Babu
Journal of colloid and interface science 320 (1), 219-237, 2008
Achievement of high planarization efficiency in CMP of copper at a reduced down pressure
S Pandija, D Roy, SV Babu
Microelectronic Engineering 86 (3), 367-373, 2009
Copper dissolution in aqueous ammonia-containing media during chemical mechanical polishing
Q Luo, RA Mackay, SV Babu
Chemistry of materials 9 (10), 2101-2106, 1997
Metallized plastics 2: fundamental and applied aspects
KL Mittal
Springer Science & Business Media, 2013
Relative roles of H 2 O 2 and glycine in CMP of copper studied with impedance spectroscopy
J Lu, JE Garland, CM Pettit, SV Babu, D Roy
Journal of The Electrochemical Society 151 (10), G717, 2004
Stabilization of Alumina Slurry for Chemical− Mechanical Polishing of Copper
Q Luo, DR Campbell, SV Babu
Langmuir 12 (15), 3563-3566, 1996
Excimer laser induced ablation of polyetheretherketone, polyimide, and polytetrafluoroethylene
SV Babu, GC D’couto, FD Egitto
Journal of applied physics 72 (2), 692-698, 1992
Citric acid as a complexing agent in CMP of copper: Investigation of surface reactions using impedance spectroscopy
VRK Gorantla, KA Assiongbon, SV Babu, D Roy
Journal of the Electrochemical Society 152 (5), G404, 2005
Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper
Y Hong, VK Devarapalli, D Roy, SV Babu
Journal of The Electrochemical Society 154 (6), H444, 2007
Chemical mechanical polishing using mixed abrasive slurries
A Jindal, S Hegde, SV Babu
Electrochemical and Solid State Letters 5 (7), G48, 2002
Reactive ion etching of monocrystalline, polycrystalline, and amorphous silicon carbide in CF4/O2 mixtures
R Padiyath, RL Wright, MI Chaudhry, SV Babu
Applied physics letters 58 (10), 1053-1055, 1991
Chemical–mechanical polishing of copper and tantalum with silica abrasives
Y Li, M Hariharaputhiran, SV Babu
Journal of Materials Research 16 (4), 1066-1073, 2001
Advances in chemical mechanical planarization (CMP)
S Babu
Elsevier, 2016
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