| Solvent-free deposition of ultrathin copolymer films with tunable viscoelasticity for application to pressure-sensitive adhesives H Moon, K Jeong, MJ Kwak, SQ Choi, SG Im ACS applied materials & interfaces 10 (38), 32668-32677, 2018 | 40 | 2018 |
| Spontaneous Generation of a Molecular Thin Hydrophobic Skin Layer on a Sub-20 nm, High-k Polymer Dielectric for Extremely Stable Organic Thin-Film Transistor … J Choi, J Yoon, MJ Kim, K Pak, C Lee, H Lee, K Jeong, K Ihm, S Yoo, ... ACS applied materials & interfaces 11 (32), 29113-29123, 2019 | 33 | 2019 |
| Heavily Crosslinked, High‐k Ultrathin Polymer Dielectrics for Flexible, Low‐Power Organic Thin‐Film Transistors (OTFTs) J Choi, J Kang, C Lee, K Jeong, SG Im Advanced Electronic Materials 6 (8), 2000314, 2020 | 26 | 2020 |
| Synthesis of a stretchable but superhydrophobic polymer thin film with conformal coverage and optical transparency MS Oh, M Jeon, K Jeong, J Ryu, SG Im Chemistry of Materials 33 (4), 1314-1320, 2021 | 22 | 2021 |
| Thermally stable and soft pressure-sensitive adhesive for foldable electronics W Jo, K Jeong, YS Park, JI Lee, SG Im, TS Kim Chemical Engineering Journal 452, 139050, 2023 | 10 | 2023 |
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Y Kim, J Kim, CY Kim, T Kim, C Lee, K Jeong, W Jo, S Yoo, TS Kim, ... Chemical Engineering Journal 431, 134074, 2022 | 9 | 2022 |
| A Sub-Micron-Thick stretchable adhesive layer for the lamination of arbitrary elastomeric substrates with enhanced adhesion stability K Jeong, Y Lee, Y Kim, H Mun, KU Kyung, SG Im Chemical Engineering Journal 429, 132250, 2022 | 9 | 2022 |
| Vapor-phase synthesis of a reagent-free self-healing polymer film with rapid recovery of toughness at room temperature and under ambient conditions K Jeong, MJ Kwak, Y Kim, Y Lee, H Mun, MJ Kim, BJ Cho, SQ Choi, ... Soft Matter 18 (36), 6907-6915, 2022 | 4 | 2022 |
| A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation YC Park, K Jeong, D Ahn, Y Kim, SG Im Organic Materials 5 (01), 66-71, 2023 | 2 | 2023 |
| A Solvent‐Free, Thermally Curable Low‐Temperature Organic Planarization Layer for Thin Film Encapsulation YC Park, HR Shim, K Jeong, SG Im Small 19 (10), 2206090, 2023 | 2 | 2023 |
| A hyperelastic adhesive forming multiple neutral planes even at extreme temperatures K Jeong, D Kim, D Ahn, C Yang, J Kim, C Lee, Y Kim, C Lee, YS Park, ... Chemical Engineering Journal 480, 148151, 2024 | 1 | 2024 |
| P‐132: A Sticky, Thermo‐curable Nano‐Adhesive for Future Flexible Display Applications: Ultrathin, Soft, and Fast‐acting MJ Kwak, K Jeong, M Joo, H Moon, SQ Choi, SG Im SID Symposium Digest of Technical Papers 50 (1), 1610-1612, 2019 | 1 | 2019 |
| Thermally Stable and Soft Pressure-Sensitive Adhesive for Foldable Electronics TS Kim, W Jo, K Jeong, YS Park, JI Lee, SG Im Available at SSRN 4110649, 0 | 1 | |
| Method of manufacturing self-healing polymer that can control physical character according to composition using initiated chemical vapor deposition IM SungGap, MJ Kwak, K Jeong, KIM Youson, Y Lee US Patent 11,680,124, 2023 | | 2023 |
| 69‐2: A Universal Method for the Lamination of Arbitrary Stretchable Substrate Pairs without Compromising the Elastic Properties of the Substrates K Jeong, Y Lee, Y Kim, H Mun, KU Kyung, SG Im SID Symposium Digest of Technical Papers 53 (1), 926-928, 2022 | | 2022 |
| A Universal Method for the Lamination of Arbitrary Stretchable Substrate Pairs without Compromising the Elastic Properties of the Substrates K Jeong, Y Lee, Y Kim, H Mun, KU Kyung, SG Im Display Week 2022, 922-925, 2022 | | 2022 |
