Quang Bang Tao
Quang Bang Tao
The University of Danang - University of Science and Technology
Bestätigte E-Mail-Adresse bei dut.udn.vn - Startseite
Titel
Zitiert von
Zitiert von
Jahr
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
L Benabou, V Etgens, QB Tao
Microelectronics Reliability 65, 243-254, 2016
512016
Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints
QB Tao, L Benabou, L Vivet, VN Le, FB Ouezdou
Materials Science and Engineering: A 669, 403-416, 2016
352016
Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni
QB Tao, L Benabou, VN Le, H Hwang, DB Luu
Journal of Alloys and Compounds 694, 892-904, 2017
212017
Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
VN Le, L Benabou, QB Tao, V Etgens
International Journal of Solids and Structures 106, 1-12, 2017
212017
Creep behavior of Innolot solder alloy using small lap-shear specimens
QB Tao, L Benabou, KL Tan, JM Morelle, FB Ouezdou
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-6, 2015
142015
A design of a new miniature device for solder joints’ mechanical properties evaluation
QB Tao, L Benabou, L Vivet, KL Tan, JM Morelle, VN Le, F Ben Ouezdou
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2017
112017
Development and first assessment of a DIC system for a micro-tensile tester used for solder characterization
L Benabou, QB Tao
Experimental Techniques 41 (3), 317-326, 2017
102017
Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
QB Tao, L Benabou, TAN Van, H Nguyen-Xuan
Journal of Alloys and Compounds 789, 183-192, 2019
52019
Microstructural effects of isothermal aging on a doped SAC solder alloy
L Benabou, L Vivet, QB Tao, NH Tran
International Journal of Materials Research 109 (1), 76-82, 2018
52018
Determination of representative dimension parameter values of Korean knee joints for knee joint implant design
DS Kwak, QB Tao, M Todo, I Jeon
Proceedings of the Institution of Mechanical Engineers, Part H: Journal of …, 2012
42012
CT reconstruction from a limited number of X-ray projections
TQ Bang, I Jeon
World Academy of Science, Engineering and Technology 5 (10), 488-490, 2011
42011
Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy
VN Le, L Benabou, V Etgens, QB Tao
Procedia Structural Integrity 2, 2614-2622, 2016
32016
The Evaluation of the Interaction Between Human Buttocks Thighs and Wheelchair Seat Cushion to Prevent Pressure Ulcers Using Finite Element Analysis
HT Bui, P Lestriez, QB Tao, K Debray, TH Van Nguyen, R Taiar
International Conference on Human Systems Engineering and Design: Future …, 2018
22018
Modeling of Position Control for Hydraulic Cylinder Using Servo Valve
NH Tran, QB Tao, TT Huynh, XT Tran, NT Vo
Asian Conference on Intelligent Information and Database Systems, 696-706, 2018
22018
Evaluation of the creep behavior of lead-free SnAgCuBiNi solder joints using in-situ micro-tensile testing
QB Tao, L Benabou, KL Tan, JM Morelle, FB Ouezdou, L Chassagne
Proc of the 13th International Conference on Creep and Fracture of …, 2015
22015
Identifying Factors That Influence Pressure Ulcers by Numerical Simulation and Experimentation Methods A Case Study.
HT Bui, LV Nguyen, ANT Ho, QB Tao, TN Ngo
International Journal of Online & Biomedical Engineering 16 (11), 2020
2020
Methodology for DIC-based evaluation of the fracture behaviour of solder materials under monotonic and creep loadings
L Benabou, TA Nguyen-Van, QB Tao, VN Le, MO Ouali, H Nguyen-Xuan
Engineering Fracture Mechanics 239, 107285, 2020
2020
A data-driven approach based on long short-term memory and hidden Markov model for crack propagation prediction
DH Nguyen-Le, QB Tao, VH Nguyen, M Abdel-Wahab, H Nguyen-Xuan
Engineering Fracture Mechanics, 107085, 2020
2020
Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique
TQ Bang, NVT An, L Benabou, NX Hung
Vietnam Journal of Mechanics 42 (1), 15-27, 2020
2020
Mechanical and Microstructural Analysis of an Ultra-Flexible Nano-Silver Paste Sintered Joint
L Benabou, QB Tao, TA Nguyen-Van, XD Wang, L Chassagne
Key Engineering Materials 865, 25-30, 2020
2020
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