Eric J.R. Phua, PhD
Eric J.R. Phua, PhD
Nanyang Technological University - Technical University of Munich
ยืนยันอีเมลแล้วที่ ntu.edu.sg - หน้าแรก
ชื่อ
อ้างโดย
อ้างโดย
ปี
High-density 3D-boron nitride and 3D-graphene for high-performance nano–thermal interface material
M Loeblein, SH Tsang, M Pawlik, EJR Phua, H Yong, XW Zhang, CL Gan, ...
ACS nano 11 (2), 2033-2044, 2017
702017
Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300 C/30kpsi) applications
LC Wai, WW Seit, EPJ Rong, MZ Ding, VS Rao, DR MinWoo
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 335-340, 2013
192013
Novel high temperature polymeric encapsulation material for extreme environment electronics packaging
EJR Phua, M Liu, B Cho, Q Liu, S Amini, X Hu, CL Gan
Materials & Design 141, 202-209, 2018
152018
A low-profile three-dimensional neural probe array using a silicon lead transfer structure
MY Cheng, M Je, KL Tan, EL Tan, R Lim, L Yao, P Li, WT Park, EJR Phua, ...
Journal of Micromechanics and Microengineering 23 (9), 095013, 2013
142013
Cyanate ester-based encapsulation material for high-temperature applications
V Chidambaram, EPJ Rong, GC Lip, RMW Daniel
Journal of electronic materials 42 (9), 2803-2812, 2013
122013
Pb-free glass paste: a metallization-free die-attachment solution for high-temperature application on ceramic substrates
A Sharif, J zhang Lim, RI Made, FL Lau, EJR Phua, JD Lim, CC Wong, ...
Journal of electronic materials 42 (8), 2667-2676, 2013
122013
Transient liquid phase (TLP) bonding using Sn/Ag multilayers for high temperature applications
NS Nobeen, R Imade, BR Lee, EJR Phua, CC Wong, CL Gan, Z Chen
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 647-652, 2013
82013
Improved mechanical and thermomechanical properties of alumina substrate via iron doping
RI Made, EJR Phua, SS Pramana, CC Wong, Z Chen, AIY Tok, CL Gan
Scripta Materialia 68 (11), 869-872, 2013
42013
Study of thin film metallization adhesion in ceramic multichip module
LJ Dy, EPJ Rong, IM Riko, A Sharif, LJ Zhang, LF Long, GC Lip, C Zhong, ...
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 67-71, 2012
42012
Development of ruggedized timer and temperature sensor packaging for 300° C/30kpsi downhole environment
HH Yuan, H Kuruveettil, EWL Ching, EPJ Rong, GC Lip, DRM Woo
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 606-610, 2014
32014
Performance enhancement of Au-Ge eutectic alloys for high-temperature electronics
V Chidambaram, EPJ Rong, GC Lip, MWD Rhee
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 202-207, 2013
22013
Study of metal additives to alumina substrate for high temperature and pressure application
IM Riko, SS Pramana, EPJ Rong, WC Cheong, C Zhong, ATI Yoong, ...
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 48-51, 2012
22012
Development of polymeric microelectronics packaging encapsulation for harsh environment applications
EJR Phua
12018
Extreme high pressure and high temperature package development
HH Yuan, EWL Ching, CY Sing, V Chidambaram, LJ Bum, EPJ Rong, ...
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 379-383, 2013
12013
Electronic Packages for High Pressure Applications: A Dome-Shaped Cavity Design
DRMW Eric Jian Rong Phua, Riko I Made,Ahmed Sharif
IEEE Electronic Components and Technology Conference, 2013
12013
Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
EJR Phua, M Liu, RI Made, L Zhang, CC Wong, Z Chen, MW Rhee, X Hu, ...
Additional Papers and Presentations 2013 (HITEN), 000268-000274, 2013
12013
Study of electrical property of Au-Ge eutectic solder alloys for high temperature electronics
LF Long, IM Riko, WN Putra, EPJ Rong, LJ Zhang, LJ Dy, WC Cheong, ...
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 30-33, 2012
12012
Ceramic—Ceramic joining using glass frit for high temperature application
LJ Zhang, A Sharif, HB Yeung, EPJ Rong, IM Riko, LF Long, LJ Dy, ...
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 38-42, 2012
12012
Behavior of Resorcinol based Phthalonitrile as High Temperature Encapsulant
YS Tay, JRE Phua, CL Gan
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 711-715, 2019
2019
Phthalonitrile-Based Electronic Packages for High Temperature Applications
EJR PHUA, LIU Ming, JSK LIM, CHO Bokun, CL GAN
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 537-542, 2018
2018
ระบบไม่สามารถดำเนินการได้ในขณะนี้ โปรดลองใหม่อีกครั้งในภายหลัง
บทความ 1–20