| High-density 3D-boron nitride and 3D-graphene for high-performance nano–thermal interface material M Loeblein, SH Tsang, M Pawlik, EJR Phua, H Yong, XW Zhang, CL Gan, ... ACS nano 11 (2), 2033-2044, 2017 | 176 | 2017 |
| Novel high temperature polymeric encapsulation material for extreme environment electronics packaging EJR Phua, M Liu, B Cho, Q Liu, S Amini, X Hu, CL Gan Materials & Design 141, 202-209, 2018 | 40 | 2018 |
| Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300° c/30kpsi) applications LC Wai, WW Seit, EPJ Rong, MZ Ding, VS Rao, DR MinWoo 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 335-340, 2013 | 23 | 2013 |
| A low-profile three-dimensional neural probe array using a silicon lead transfer structure MY Cheng, M Je, KL Tan, EL Tan, R Lim, L Yao, P Li, WT Park, EJR Phua, ... Journal of Micromechanics and Microengineering 23 (9), 095013, 2013 | 21 | 2013 |
| Cyanate ester-based encapsulation material for high-temperature applications V Chidambaram, EPJ Rong, GC Lip, RMW Daniel Journal of electronic materials 42, 2803-2812, 2013 | 19 | 2013 |
| Pb-Free glass paste: a metallization-free die-attachment solution for high-temperature application on ceramic substrates A Sharif, JZ Lim, RI Made, FL Lau, EJR Phua, JD Lim, CC Wong, CL Gan, ... Journal of electronic materials 42, 2667-2676, 2013 | 14 | 2013 |
| Transient liquid phase (TLP) bonding using Sn/Ag multilayers for high temperature applications NS Nobeen, R Imade, BR Lee, EJR Phua, CC Wong, CL Gan, Z Chen 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 647-652, 2013 | 10 | 2013 |
| Extreme high pressure and high temperature package development HH Yuan, EWL Ching, CY Sing, V Chidambaram, LJ Bum, EPJ Rong, ... 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 379-383, 2013 | 6 | 2013 |
| Improved mechanical and thermomechanical properties of alumina substrate via iron doping RI Made, EJR Phua, SS Pramana, CC Wong, Z Chen, AIY Tok, CL Gan Scripta Materialia 68 (11), 869-872, 2013 | 5 | 2013 |
| Development of ruggedized timer and temperature sensor packaging for 300° C/30kpsi downhole environment HH Yuan, H Kuruveettil, EWL Ching, EPJ Rong, GC Lip, DRM Woo 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 606-610, 2014 | 4 | 2014 |
| Study of thin film metallization adhesion in ceramic multichip module LJ Dy, EPJ Rong, IM Riko, A Sharif, LJ Zhang, LF Long, GC Lip, C Zhong, ... 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 67-71, 2012 | 4 | 2012 |
| Electronic Packages for High Pressure Applications: A Dome-Shaped Cavity Design DRMW Eric Jian Rong Phua, Riko I Made,Ahmed Sharif IEEE Electronic Components and Technology Conference, 2013 | 3 | 2013 |
| Ceramic—Ceramic joining using glass frit for high temperature application LJ Zhang, A Sharif, HB Yeung, EPJ Rong, IM Riko, LF Long, LJ Dy, ... 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 38-42, 2012 | 3 | 2012 |
| Behavior of resorcinol based phthalonitrile as high temperature encapsulant YS Tay, JRE Phua, CL Gan 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 711-715, 2019 | 2 | 2019 |
| Performance enhancement of Au-Ge eutectic alloys for high-temperature electronics V Chidambaram, EPJ Rong, GC Lip, MWD Rhee 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 202-207, 2013 | 2 | 2013 |
| Study of metal additives to alumina substrate for high temperature and pressure application IM Riko, SS Pramana, EPJ Rong, WC Cheong, C Zhong, ATI Yoong, ... 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 48-51, 2012 | 2 | 2012 |
| Simultaneous enhancement of polymerization kinetics and properties of phthalonitrile using alumina fillers YS Tay, EJR Phua, Z Chen, CL Gan ACS omega 7 (37), 32996-33003, 2022 | 1 | 2022 |
| Phthalonitrile-based electronic packages for high temperature applications EJR PHUA, LIU Ming, JSK LIM, CHO Bokun, CL GAN 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 537-542, 2018 | 1 | 2018 |
| Development of polymeric microelectronics packaging encapsulation for harsh environment applications EJR Phua Nanyang Technological University, 2018 | 1 | 2018 |
| Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications EJR Phua, M Liu, RI Made, L Zhang, CC Wong, Z Chen, MW Rhee, X Hu, ... Additional Papers and Presentations 2013 (HITEN), 000268-000274, 2013 | 1 | 2013 |
Riko I MadeA*STARยืนยันอีเมลแล้วที่ imre.a-star.edu.sg
