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Philip EisenlohrAssociate Professor, Chemical Engineering and Materials Science, Michigan State UniversityVerified email at egr.msu.edu
Tae-Kyu LeeCisco SystemsVerified email at cisco.com
Amiya MukherjeeProfessor of Materials Science and Engineering, University of California , Davis, CAVerified email at ucdavis.edu
S L SemiatinSenior Scientist (emeritus), Materials Processing/Processing Science, Air Force Research LaboratoryVerified email at us.af.mil
Bite ZhouFailure Analysis R&D Engineer, Intel CorporationVerified email at intel.com
Leyun WangShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Dierk RaabeMax-Planck-Institut für Eisenforschung GmbHVerified email at mpie.de
Chen ZhangOak Ridge National LabVerified email at ornl.gov
Hongmei LiIntel Corp.Verified email at intel.com
Rajiv S. MishraProfessor of Materials Science and Engineering, University of North TexasVerified email at unt.edu
Quan (Jason) ZhouHitachi America, Ltd.Verified email at hal.hitachi.com
Fu GuoProfessor, College of Materials Science and Engineering, Beijing University of TechnologyVerified email at bjut.edu.cn
David MercierSr Project Manager - PhDVerified email at ansys.com
Denny Dharmawan TjahjantoNKT HV Cables ABVerified email at nkt.com
Claudio ZambaldiScientist at Max-Planck-Institut für EisenforschungVerified email at mpie.de
A. J. BeaudoinUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Karl HartwigTexas A&M UniversityVerified email at tamu.edu
Deepak Kumar, Ph.D.Technical Lead - at Dow ChemicalVerified email at dow.com
Patrick KwonMichigan State UniversityVerified email at egr.msu.edu
Jun-Sang ParkArgonne National LaboratoryVerified email at anl.gov