| Advanced fabrication processes for superconducting very large-scale integrated circuits SK Tolpygo, V Bolkhovsky, TJ Weir, A Wynn, DE Oates, LM Johnson, ... IEEE Transactions on Applied Superconductivity 26 (3), 1-10, 2016 | 248 | 2016 |
| Electrical control of near-field energy transfer between quantum dots and two-dimensional semiconductors D Prasai, AR Klots, AKM Newaz, JS Niezgoda, NJ Orfield, CA Escobar, ... Nano letters 15 (7), 4374-4380, 2015 | 134 | 2015 |
| Advanced fabrication processes for superconductor electronics: Current status and new developments SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, E Golden, TJ Weir, ... IEEE Transactions on Applied Superconductivity 29 (5), 1-13, 2019 | 99 | 2019 |
| Properties of unshunted and resistively shunted Nb/AlOx-Al/Nb Josephson junctions with critical current densities from 0.1 to 1 mA/μm2 SK Tolpygo, V Bolkhovsky, S Zarr, TJ Weir, A Wynn, AL Day, LM Johnson, ... IEEE Transactions on Applied Superconductivity 27 (4), 1-15, 2017 | 77 | 2017 |
| Superconductor electronics fabrication process with MoNx kinetic inductors and self-shunted Josephson junctions SK Tolpygo, V Bolkhovsky, DE Oates, R Rastogi, S Zarr, AL Day, TJ Weir, ... IEEE Transactions on Applied Superconductivity 28 (4), 1-12, 2018 | 60 | 2018 |
| Synaptic weighting in single flux quantum neuromorphic computing ML Schneider, CA Donnelly, IW Haygood, A Wynn, SE Russek, ... Scientific Reports 10 (1), 934, 2020 | 34 | 2020 |
| Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, E Golden, TJ Weir, ... IEEE Transactions on Applied Superconductivity 29 (5), 1-8, 2019 | 26 | 2019 |
| Developments toward a 250-nm, fully planarized fabrication process with ten superconducting layers and self-shunted Josephson junctions SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, TJ Weir, A Wynn, ... 2017 16th International Superconductive Electronics Conference (ISEC), 1-3, 2017 | 18 | 2017 |
| Superconducting computing with alternating logic elements G Tzimpragos, J Volk, A Wynn, JE Smith, T Sherwood 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture …, 2021 | 13 | 2021 |
| Wafer-scale characterization of a superconductor integrated circuit fabrication process, using a cryogenic wafer prober JT West, A Kurlej, A Wynn, C Rogers, MA Gouker, SK Tolpygo IEEE Transactions on Applied Superconductivity 32 (5), 1-12, 2022 | 7* | 2022 |
| Waferscale S-MCM for high performance computing RN Das, V Bolkhovsky, A Wynn, R Rastogi, S Zarr, D Shapiro, M Docanto, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 582-588, 2020 | 6 | 2020 |
| Analysis of multilayer devices for superconducting electronics by high-resolution scanning transmission electron microscopy and energy dispersive spectroscopy N Missert, PG Kotula, M Rye, L Rehm, V Sluka, AD Kent, D Yohannes, ... IEEE Transactions on Applied Superconductivity 27 (4), 1-4, 2017 | 6 | 2017 |
| Low-Cost Superconducting Fan-Out with Cell IC Ranking J Volk, G Tzimpragos, A Wynn, E Golden, T Sherwood IEEE Transactions on Applied Superconductivity, 2023 | 3* | 2023 |
| Reliability Studies of Nb/AlOx/Al/Nb Josephson Junctions Through Accelerated-Life Electrical Stress Testing US Goteti, M Denton, K Krause, A Stephen, JA Sellers, S Sullivan, ... IEEE Transactions on Applied Superconductivity 29 (5), 1-7, 2019 | 3 | 2019 |
| Ambient temperature thermally-induced voltage alteration (TIVA) for identification of defects in superconducting electronics MW Jenkins, P Tangyunyong, NA Missert, AA Pimentel, I Vernik, ... ISTFA 2018: Proceedings from the 44th International Symposium for Testing …, 2018 | 2 | 2018 |
| Addressable superconductor integrated circuit memory from delay lines J Volk, A Wynn, E Golden, T Sherwood, G Tzimpragos Scientific Reports 13 (1), 16639, 2023 | 1* | 2023 |
| Extremely Large Area Integrated Circuit (ELAIC): An Advanced Packaging Solution for Chiplets RN Das, J Plant, A Wynn, M Ricci, R Johnson, M Stamplis, B Tyrrell, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 258-265, 2023 | 1 | 2023 |
| Integrated Superconducting Transition-Edge-Sensor Energy Readout (ISTER) SW Leman, EB Golden, MC Guyton, KK Ryu, VK Semenov, A Wynn IEEE Transactions on Applied Superconductivity, 2023 | 1 | 2023 |
| Design and simulation of phase synchronizer for adiabatic quantum flux parametron circuits LC Blackburn, E Golden, A Wynn, A Wagner, N Gershenfeld IEEE Transactions on Applied Superconductivity 33 (5), 1-5, 2023 | 1 | 2023 |
| Superconducting parametric amplifier neural network A Wynn US Patent 11,556,769, 2023 | 1 | 2023 |
Sergey K. TolpygoLincoln Laboratory, Massachusetts Institute of TechnologyVerified email at ll.mit.edu
