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Co-authors
- Taiuk RimPohang University of Science and TechnologyVerified email at postech.ac.kr
- M. MeyyappanNASA Ames Research CenterVerified email at nasa.gov
- JEONG-SOO LEEDepartment of electrical engineering, Pohang University of Science and TechnologyVerified email at postech.ac.kr
- Junsik Yoon (Jun-Sik Yoon)Electrical Engineering, POSTECHVerified email at postech.ac.kr
- Gianaurelio (Giovanni) CunibertiTU Dresden; https://ORCID.org/0000-0002-6574-7848Verified email at tu-dresden.de
- Rock-Hyun BaekPOSTECH, Electrical EngineeringVerified email at postech.ac.kr
- Larysa BarabanHelmholtz Center Dresden Rossendorf and TU DresdenVerified email at hzdr.de
- Byoung Don KongPohang University of Science and Technology(POSTECH)Verified email at postech.ac.kr
- Bergoi IbarluceaTecnaliaVerified email at tecnalia.com
- Eunhye BaekTsinghua UniversityVerified email at tsinghua.edu.cn
- Kim JungsikGyeongsang National UniversityVerified email at gnu.ac.kr
- Seonghoon JinSamsung Semiconductor IncVerified email at samsung.com
- Sung-Min HongSchool of EECS, Gwangju Institute of Science and TechnologyVerified email at gist.ac.kr
- Bomsoo KimPrincipal Engineer, Samsung ElectronicsVerified email at us.ibm.com
- CH PARKSamsung ElectronicsVerified email at umd.edu
- SangWook ParkSamsung Electronics; TU Dresden; The Univ. of Tokyo; Seoul National Univ.Verified email at tu-dresden.de