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you tao
Army Institute of Surgical Research
Bestätigte E-Mail-Adresse bei amedd.army.mil
Titel
Zitiert von
Zitiert von
Jahr
Effect of light quality on production of extracellular polysaccharides and growth rate of Porphyridium cruentum
T You, SM Barnett
Biochemical engineering journal 19 (3), 251-258, 2004
2132004
Exacerbated and prolonged inflammation impairs wound healing and increases scarring
LW Qian, AB Fourcaudot, K Yamane, T You, RK Chan, KP Leung
Wound repair and regeneration 24 (1), 26-34, 2016
1572016
Antimicrobial activity of nanoemulsion in combination with cetylpyridinium chloride in multidrug-resistant Acinetobacter baumannii
YY Hwang, K Ramalingam, DR Bienek, V Lee, T You, R Alvarez
Antimicrobial agents and chemotherapy 57 (8), 3568-3575, 2013
1072013
Ceramic temperature sensors for harsh environments
OJ Gregory, T You
IEEE sensors journal 5 (5), 833-838, 2005
882005
Snail-regulated MiR-375 inhibits migration and invasion of gastric cancer cells by targeting JAK2
Y Xu, J Jin, Y Liu, Z Huang, Y Deng, T You, T Zhou, J Si, W Zhuo
PloS one 9 (7), e99516, 2014
742014
Sublethal concentrations of carbapenems alter cell morphology and genomic expression of Klebsiella pneumoniae biofilms
TA Van Laar, T Chen, T You, KP Leung
Antimicrobial agents and chemotherapy 59 (3), 1707-1717, 2015
632015
The Effect of Denture Cleansing Solutions on the Retention of Pink Locator Attachments after Multiple Pulls: An In Vitro Study
W You, R Masri, E Romberg, CF Driscoll, T You
Journal of Prosthodontics 20 (6), 464-469, 2011
592011
Effect of aluminum doping on the high-temperature stability and piezoresistive response of indium tin oxide strain sensors
OJ Gregory, T You, EE Crisman
Thin Solid Films 476 (2), 344-351, 2005
562005
Formation of Pseudomonas aeruginosa Biofilms in Full-thickness Scald Burn Wounds in Rats
KS Brandenburg, AJ Weaver Jr, SLR Karna, T You, P Chen, SV Stryk, ...
Scientific reports 9 (1), 13627, 2019
462019
Understanding the host inflammatory response to wound infection: An in vivo study of Klebsiella pneumoniae in a rabbit ear wound model
AK Seth, MR Geringer, AN Gurjala, JA Abercrombie, P Chen, T You, ...
Wound Repair and Regeneration, 2012
382012
Antimicrobial ceragenins inhibit biofilms and affect mammalian cell viability and migration in vitro
MA Olekson, T You, PB Savage, KP Leung
FEBS Open Bio 7 (7), 953-967, 2017
372017
Piezoresistive properties of ITO strain sensors prepared with controlled nanoporosity
OJ Gregory, T You
Journal of the Electrochemical Society 151 (8), H198, 2004
372004
Development of Pseudomonas aeruginosa Biofilms in Partial-Thickness Burn Wounds Using a Sprague-Dawley Rat Model
KS Brandenburg, AJ Weaver Jr, L Qian, T You, P Chen, SLR Karna, ...
Journal of Burn Care & Research 40 (1), 44-57, 2019
362019
Global transcriptome responses including small RNAs during mixed‐species interactions with methicillin‐resistant Staphylococcus aureus and Pseudomonas aeruginosa
CL Miller, TA Van Laar, T Chen, SLR Karna, P Chen, T You, KP Leung
Microbiologyopen 6 (3), e00427, 2017
352017
Release of a wound-healing agent from PLGA microspheres in a thermosensitive gel
HA Machado, JJ Abercrombie, T You, PP DeLuca, KP Leung
BioMed Research International 2013, 2013
302013
MrkD1P from Klebsiella pneumoniae Strain IA565 Allows for Coexistence with Pseudomonas aeruginosa and Protection from Protease-Mediated Biofilm Detachment
BM Childers, TA Van Laar, T You, S Clegg, KP Leung
Infection and Immunity 81 (11), 4112-4120, 2013
262013
RNA-Seq Transcriptomic Responses of Full-Thickness Dermal Excision Wounds to Pseudomonas aeruginosa Acute and Biofilm Infection
SLR Karna, P D’Arpa, T Chen, LW Qian, AB Fourcaudot, K Yamane, ...
PLoS One 11 (10), e0165312, 2016
202016
Thin film ceramic thermocouples
O Gregory, G Fralick, J Wrbanek, T You
US Patent 8,052,324, 2011
20*2011
Stability and piezoresistive properties of indium-tin-oxide ceramic strain gages
OJ Gregory, T You
SENSORS, 2003 IEEE 2, 801-806, 2003
142003
The extended peridynamic model for elastoplastic and/or fracture problems
WJ Li, T You, T Ni, QZ Zhu, L Hien Poh
International Journal for Numerical Methods in Engineering 123 (21), 5201-5229, 2022
112022
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