Fulya Kaplan
Title
Cited by
Cited by
Year
Optimizing communication and cooling costs in HPC data centers via intelligent job allocation
F Kaplan, J Meng, AK Coskun
2013 International Green Computing Conference Proceedings, 1-10, 2013
232013
Modeling and analysis of phase change materials for efficient thermal management
F Kaplan, C De Vivero, S Howes, M Arora, H Homayoun, W Burleson, ...
2014 IEEE 32nd International Conference on Computer Design (ICCD), 256-263, 2014
212014
Simulation and optimization of HPC job allocation for jointly reducing communication and cooling costs
J Meng, S McCauley, F Kaplan, VJ Leung, AK Coskun
Sustainable Computing: Informatics and Systems 6, 48-57, 2015
192015
Level-spread: A new job allocation policy for dragonfly networks
Y Zhang, O Tuncer, F Kaplan, K Olcoz, VJ Leung, AK Coskun
2018 IEEE International Parallel and Distributed Processing Symposium (IPDPS …, 2018
82018
Unveiling the interplay between global link arrangements and network management algorithms on dragonfly networks
F Kaplan, O Tuncer, VJ Leung, SK Hemmert, AK Coskun
2017 17th IEEE/ACM International Symposium on Cluster, Cloud and Grid …, 2017
82017
Communication and cooling aware job allocation in data centers for communication-intensive workloads
J Meng, E Llamosí, F Kaplan, C Zhang, J Sheng, M Herbordt, G Schirner, ...
Journal of Parallel and Distributed Computing 96, 181-193, 2016
82016
Predictive management of heterogeneous processing systems
F Kaplan, M Arora, I Paul, WP Burleson
US Patent App. 14/488,874, 2016
72016
Fast thermal modeling of liquid, thermoelectric, and hybrid cooling
F Kaplan, S Reda, AK Coskun
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
62017
Adaptive sprinting: How to get the most out of Phase Change based passive cooling
F Kaplan, AK Coskun
2015 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2015
42015
Topology-aware reliability optimization for multiprocessor systems
J Meng, F Kaplan, M Hsieh, AK Coskun
2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip …, 2012
32012
Locool: Fighting hot spots locally for improving system energy efficiency
F Kaplan, M Said, S Reda, AK Coskun
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019
22019
Design Optimization of 3D Multi-Processor System-on-Chip with Integrated Flow Cell Arrays
A Andreev, F Kaplan, M Zapater, AK Coskun, D Atienza
Proceedings of the International Symposium on Low Power Electronics and …, 2018
22018
Control of thermal energy transfer for phase change material in data center
F Kaplan, M Arora, WP Burleson, I Paul, Y Eckert
US Patent App. 14/709,655, 2016
22016
Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed
C De Vivero, F Kaplan, AK Coskun
ASME 2015 International Technical Conference and Exhibition on Packaging and …, 2015
22015
10 Thermal Modeling
T Zhang, F Kaplan, AK Coskun
Physical Design for 3D Integrated Circuits, 229, 2017
2017
Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies
F Kaplan
Boston University, 2017
2017
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