Eye Height/Width Prediction From N Ambasana, G Anand, B Mutnury, D Gope
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (6 …, 2016
26 2016 S-parameter and frequency identification method for ANN-based eye-height/width prediction N Ambasana, G Anand, D Gope, B Mutnury
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (5 …, 2017
15 2017 Application of artificial neural networks for eye-height/width prediction from S-parameters N Ambasana, D Gope, B Mutnury, G Anand
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014
15 2014 Design space and frequency extrapolation: Using neural networks OW Bhatti, N Ambasana, M Swaminathan
IEEE Microwave Magazine 22 (10), 22-36, 2021
10 2021 Automated frequency selection for machine-learning based EH/EW prediction from S-Parameters N Ambasana, D Gope, B Mutnury, G Anand
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems …, 2015
6 2015 Eye-height/width prediction from S-parameters using bounded size training set for ANN N Ambasana, D Gope, B Mutnury, G Anand
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS …, 2014
5 2014 Invertible neural networks for high-speed channel design & parameter distribution estimation N Ambasana, OW Bhatti, MA Dolatsara, M Swaminathan, X Yang, ...
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021
4 2021 Analysis of increased parallelism in fpga implementation of neural networks for environment/noise classification and removal NB Ambasana, M Zaveri
2012 Nirma University International Conference on Engineering (NUiCONE), 1-5, 2012
4 2012 Inverse design of power delivery networks using invertible neural networks OW Bhatti, N Ambasana, M Swaminathan
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021
3 2021 Comparison of invertible architectures for high speed channel design OW Bhatti, O Akinwande, N Ambasana, X Yang, PR Paladhi, WD Becker, ...
2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021
2 2021 Machine learning based uncertainty quantification of extrapolated design space and frequency response for rf structures OW Bhatti, N Ambasana, M Swaminathan
2021 IEEE MTT-S International Microwave Symposium (IMS), 16-19, 2021
2 2021 Mesh-sensitivity based decoupling capacitor sizing and placement for power delivery networks N Ambasana, D Gope
2017 IEEE 21st Workshop on Signal and Power Integrity (SPI), 1-4, 2017
2 2017 Thermal-Aware SoC Macro Placement and Multi-chip Module Design Optimization with Bayesian Optimization M Molter, R Kumar, S Koller, OW Bhatti, N Ambasana, E Rosenbaum, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 935-942, 2023
1 2023 Black-box behavioral DC-DC converter IC emission model SR Rao, N Ishibashi, B Nayak, H Muniganti, N Ambasana, V Sahu, ...
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
1 2022 Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis M Sahoo, D Gope, N Ambasana, D Eesha, A Chandrasekhar
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019
1 2019 A method to model Vccinfeedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators-Distributed Formulation S Govindan, K Bharath, D Gope, S Venkataraman, N Ambasana
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019
1 2019 Application of qualitative imaging methods to electrical performance-aware package board design N Ambasana, D Gope, A Chandrasekhar
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging …, 2013
1 2013 A learning-based surrogate model of conducted noise from integrated circuits (ics) under different operating conditions BP Nayak, N Ambasana, LK Manepalli, D Nath, H Muniganti, D Anant, ...
US Patent App. 18/035,113, 2024
2024 Package Design and Measurements for Radar Emulator using Accelerators and Photonics M Daniel-Aguebor, MU Rehman, S Erdogan, KSJ Moon, N Ambasana, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1342-1348, 2022
2022 2021 Index IEEE Microwave Magazine Vol. 22 J Aghassi-Hagmann, Z Ahmed, N Ambasana, O Amper, Y Antar, A Apte, ...
IEEE Microwave Magazine 22 (12), 2021
2021 