| Design and optimization of planar multimode waveguides for high speed board-level optical interconnects K Nieweglowski, R Rieske, S Sohr, KJ Wolter 2013 IEEE 63rd Electronic Components and Technology Conference, 1898-1904, 2013 | 21 | 2013 |
| & Meyendorf, N.(May 2008). Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers S Walter, K Nieweglowski, L Rebenklau, KJ Wolter, B Lamek, F Schubert 2008 31st International Spring Seminar on Electronics Technology, 255-260, 0 | 21 | |
| Energy-efficient transceivers for ultra-highspeed computer board-to-board communication M Jenning, B Klein, R Hahnel, D Plettemeier, D Fritsche, G Tretter, ... 2015 IEEE International Conference on Ubiquitous Wireless Broadband (ICUWB), 1-5, 2015 | 20 | 2015 |
| Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems K Nieweglowski, L Lorenz, S Lüngen, T Tiedje, KJ Wolter, K Bock Microelectronics Reliability 84, 121-126, 2018 | 19 | 2018 |
| Demonstration of board-level optical link with ceramic optoelectronic multi-chip module K Nieweglowski, R Rieske, KJ Wolter 2009 59th Electronic Components and Technology Conference, 1879-1886, 2009 | 16 | 2009 |
| Asymmetric optical bus coupler for interruption-free short-range connections on board and module level L Lorenz, K Nieweglowski, Z Al-Husseini, N Neumann, D Plettemeier, ... Journal of Lightwave Technology 35 (18), 4033-4039, 2017 | 15 | 2017 |
| Analysis of bending effects for optical-bus-couplers L Lorenz, K Nieweglowski, KJ Wolter, K Bock 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2523-2528, 2016 | 14 | 2016 |
| Multichannel optical link based on polymer multimode waveguides for board-level interchip communication K Nieweglowski, L Lorenz, KJ Wolter, K Bock 2015 European Microelectronics Packaging Conference (EMPC), 1-7, 2015 | 13 | 2015 |
| Performance of step index multimode waveguides with tuned numerical aperture for on-board optical links K Nieweglowski, R Henker, F Ellinger, KJ Wolter Optical Interconnects XIV 8991, 27-36, 2014 | 13 | 2014 |
| Optical analysis of short-distance optical interconnect on the PCB-level K Nieweglowski, K Wolter 2006 1st Electronic Systemintegration Technology Conference 1, 392-397, 2006 | 12 | 2006 |
| Will low-cost 3D additive manufactured packaging replace the fan-out wafer level packages? T Tiedje, S Lüngen, M Schubert, M Luniak, K Nieweglowski, K Bock 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1065-1070, 2017 | 11 | 2017 |
| 3D optical coupling techniques on polymer waveguides for wafer and board level integration S Lüngen, S Charania, T Tiedje, K Nieweglowski, S Killge, L Lorenz, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1612-1618, 2017 | 10 | 2017 |
| Aerosol Jet Printed Optical Waveguides for Short Range Communication L Lorenz, K Nieweglowski, Z Al-Husseini, N Neumann, D Plettemeier, ... Journal of Lightwave Technology 38 (13), 3478-3484, 2020 | 9 | 2020 |
| Reliability of 3D additive manufactured packages S Lüngen, T Tiedje, K Meier, K Nieweglowski, K Bock 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018 | 9 | 2018 |
| Optical beam propagation and ray tracing simulation of interruption-free asymmetric multimode bus couplers L Lorenz, K Nieweglowski, KJ Wolter, F Loosen, N Lindlein, K Bock Journal of Microelectronics and Electronic Packaging 14 (1), 1-10, 2017 | 8 | 2017 |
| Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices T Ackstaller, L Lorenz, K Nieweglowski, K Bock 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019 | 7 | 2019 |
| Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging S Sohr, R Rieske, K Nieweglowski, KJ Wolter 2013 IEEE 63rd Electronic Components and Technology Conference, 1866-1873, 2013 | 7 | 2013 |
| Assembly requirements for multi-channel coupling micro-optics in board-level optical interconnects K Nieweglowski, R Rieske, KJ Wolter 3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010 | 7 | 2010 |
| Interconnect Technology Development for 180GHz Wireless mm-Wave System-in-Foil Transceivers K Nieweglowski, P Seiler, D Fritsche, S Lüngen, D Plettemeier, C Carta, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 527-532, 2018 | 6 | 2018 |
| Novel optical transmitter and receiver for parallel optical interconnects on PCB-level K Nieweglowski, KJ Wolter 2008 2nd Electronics System-Integration Technology Conference, 607-612, 2008 | 6 | 2008 |
