Bite Zhou
Bite Zhou
Failure Analysis R&D Engineer, Intel Corporation
Verified email at intel.com
Title
Cited by
Cited by
Year
The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints
TR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ...
Journal of Electronic Materials 41 (2), 283-301, 2012
912012
Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy
TK Lee, B Zhou, L Blair, KC Liu, TR Bieler
Journal of electronic materials, 1-10, 2010
742010
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface
B Zhou, TR Bieler, T Lee, KC Liu
Journal of electronic materials, 1-11, 2010
672010
Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear
B Zhou, TR Bieler, TK Lee, KC Liu
Journal of electronic materials 38 (12), 2702-2711, 2009
452009
Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder
S Mukherjee, B Zhou, A Dasgupta, TR Bieler
international Journal of Plasticity 78, 1-25, 2016
342016
Slip, crystal orientation, and damage evolution during thermal cycling in high-strain wafer-level chip-scale packages
B Zhou, Q Zhou, TR Bieler, T Lee
Journal of Electronic Materials 44 (3), 895-908, 2015
322015
Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD
B Zhou, TR Bieler, TK Lee, W Liu
Journal of electronic materials 42 (2), 319-331, 2013
302013
Microstructure and Sn crystal orientation evolution in Sn-3.5 Ag lead-free solders in high-temperature packaging applications
B Zhou, G Muralidharan, K Kurumadalli, CM Parish, S Leslie, TR Bieler
Journal of electronic materials 43 (1), 57-68, 2014
242014
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation
TK Lee, B Zhou, T Bieler, KC Liu
Journal of Electronic Materials, 1-10, 2011
222011
Microstructural evolution of SAC305 solder joints in wafer level chip-scale packaging (WLCSP) with continuous and interrupted accelerated thermal cycling
Q Zhou, B Zhou, TK Lee, T Bieler
Journal of electronic materials 45 (6), 3013-3024, 2016
212016
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects
TK Lee, W Xie, B Zhou, T Bieler, KC Liu
Journal of electronic materials 40 (9), 1967-1976, 2011
182011
Impact of isothermal aging and Sn grain orientation on the long-term reliability of wafer-level chip-scale package Sn–Ag–Cu solder interconnects
TK Lee, B Zhou, TR Bieler
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (3 …, 2012
172012
Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects
TK Lee, B Liu, B Zhou, T Bieler, KC Liu
Journal of Electronic Materials, 1-8, 2011
172011
The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance
TK Lee, B Zhou, TR Bieler, CF Tseng, JG Duh
Journal of electronic materials 42 (2), 215-223, 2013
152013
In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders
B Zhou, TR Bieler, G Wu, S Zaefferer, TK Lee, KC Liu
Journal of Electronic Materials, 1-11, 0
11
Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder
S Mukherjee, A Dasgupta, B Zhou, TR Bieler
Journal of electronic materials 43 (4), 1119-1130, 2014
102014
The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints
TR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ...
2011 International Reliability Physics Symposium, 5F. 1.1-5F. 1.9, 2011
102011
Mechanistic modeling of the anisotropic steady state creep response of SnAgCu single crystal
S Mukherjee, B Zhou, A Dasgupta, TR Bieler
International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015
62015
Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load
Y Ge, J Cook, M Pei, M Vujosevic, B Zhou, S Nad
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 684-689, 2014
22014
Characterization of SAC solder microstructure evolution during thermal cycling with statistical and in-situ methods
B Zhou, TR Bieler, G Wu, S Zaefferer, TK Lee, KC Liu
Argonne National Lab.(ANL), Argonne, IL (United States). Advanced Photon …, 2010
22010
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