| 35-GHz barium hexaferrite/PDMS composite-based millimeter-wave circulators for 5G applications R Bowrothu, HI Kim, CS Smith, DP Arnold, YK Yoon IEEE Transactions on Microwave Theory and Techniques 68 (12), 5065-5071, 2020 | 23 | 2020 |
| Metamaterial-integrated high-gain rectenna for RF sensing and energy harvesting applications W Lee, S Choi, H Kim, S Hwang, S Jeon, YK Yoon Sensors 21 (19), 6580, 2021 | 14 | 2021 |
| Integrated compact planar inverted-F antenna (PIFA) with a shorting via wall for millimeter-wave wireless chip-to-chip (C2C) communications in 3D-SiP S Hwangbo, R Bowrothu, H Kim, YK Yoon 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 983-988, 2019 | 9 | 2019 |
| Highly energy-efficient metaconductor-based integrated RF passives: Metaconductor-based RF passives R Bowrothu, H Kim, W Lee, T Clingenpeel, YK Yoon IEEE Microwave Magazine 23 (8), 83-93, 2022 | 6 | 2022 |
| High-radiation efficiency in array antennas using CU/Co metaconductors R Bowrothu, HI Kim, S Hwangbo, YK Yoon IEEE Transactions on Antennas and Propagation 69 (11), 7993-7998, 2021 | 6 | 2021 |
| Cu/Co metaconductor based highly energy-efficient bonding wires for next generation millimeter wave electronic interconnects S Jeon, HI Kim, W Lee, YK Yoon 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1442-1445, 2022 | 4 | 2022 |
| Cu/Co metaconductor based coplanar waveguide with sub 0.1 dB/mm insertion loss at 28 GHz HI Kim, R Bowrothu, YK Yoon 2021 IEEE MTT-S International Microwave Symposium (IMS), 689-692, 2021 | 4 | 2021 |
| Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications HI Kim, R Bowrothu, W Lee, YK Yoon 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1187-1192, 2021 | 4 | 2021 |
| Metamaterial-inspired dual-function loop antenna for wireless power transfer and wireless communications W Lee, H Kim, YK Yoon 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1351-1357, 2020 | 4 | 2020 |
| 3D integrated through fused silica via (TFV) based array antenna for mm wave communications R Bowrothu, H Kim, YK Yoon, S Schmidt 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 95-100, 2020 | 4 | 2020 |
| Highly Compact, Multiband Composite-Right/Left-Handed (CRLH) Transmission Line Based Stub for GPS Applications HI Kim, S Hwangbo, R Bowrothu, YK Yoon 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2085-2090, 2019 | 3 | 2019 |
| Metaconductor Based Highly Energy Efficient Differential Striplines for 112 Gbps Data Bus With Sub 0.1 dB/mm Package Insertion Loss HI Kim, S Jeon, R Hsu, B Achkir, YK Yoon 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 903-907, 2022 | 2 | 2022 |
| 3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications W Lee, H Kim, S Hwang, S Jeon, H Cho, YK Yoon 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1317-1322, 2021 | 1 | 2021 |
| Integrated Phosphate and pH Sensing System for Water Quality Monitoring R Bowrothu, T Schumann, H Kim, KT Kim, S Hwang, Y Lee, YK Yoon 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems …, 2020 | 1 | 2020 |
| Cu/Co based metaconductor array antennas YK Yoon, R Bowrothu, H Kim, S Hwangbo US Patent 11,949,163, 2024 | | 2024 |
| Metaconductor-Based High Signal Integrity Interconnects for 112 Gbps SerDes Interface with Channel Analysis HI Kim, A Wilcher, S Jeon, P Pahlavan, R Hsu, B Achkir, YK Yoon 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1012-1016, 2023 | | 2023 |
| Surface Micromachined Integrable High Efficiency Ridge Gap Waveguide Bandpass Filter for G-Band 6G Applications A Wilcher, HI Kim, Z Jia, A Phipps, J Chieh, D Arnold, YK Yoon 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1499-1503, 2023 | | 2023 |
| Highly Energy Efficient and Electromagnetic Interference Immuned Coaxial Through-Substrate-Vias (cx-TSVs) for Millimeter Wave Applications S Jeon, HI Kim, YK Yoon 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1514-1518, 2023 | | 2023 |
| Metamaterial Based Compact Patch Antenna Array for Antenna-in-Package Solutions in Frequency Handover Applications P Pahlavan, SI Choi, A Wilcher, HI Kim, H Jang, YK Yoon 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 475-480, 2023 | | 2023 |
| Highly Energy Efficient 64-element Array Antenna Based on Cu/Co Metaconductor and Fused Silica HI Kim, A Wilcher, W Lee, S Nelson, YK Yoon 2023 IEEE Wireless and Microwave Technology Conference (WAMICON), 137-139, 2023 | | 2023 |
Renuka BowrothuApple Inc.Bestätigte E-Mail-Adresse bei apple.com
