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Co-authors
- Jiawei WangHITSZ, IFW Dresden, TU Chemnitz, HKUSTVerified email at hit.edu.cn
- Qi HaoSoutheast UniversityVerified email at seu.edu.cn
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Shilong LiZhejiang UniversityVerified email at zju.edu.cn
- Jinbo Pang (https://orcid.org/0000-000...Prof of Materials Sciences @ iAIR, University of Jinan; (PhD) TU Dresden; (postdoc) IFW DresdenVerified email at ujn.edu.cn
- ShaoZhuan Huang (黄绍专)South-Central Minzu UniversityVerified email at scuec.edu.cn
- Lixia XiIFW DresdenVerified email at ifw-dresden.de
- Xiaolei SunNankai UniversityVerified email at nankai.edu.cn
- Xingce FanSoutheast University / IFW DresdenVerified email at seu.edu.cn
- Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
- Vivienne EngemaierSenior Engineer Development, Infineon Technologies Dresden GmbH & Co. KGVerified email at infineon.com
- Stefan BöttnerX-FAB Dresden GmbH & Co. KGVerified email at xfab.com
- Yan ChenNUDT
- Armando RastelliProfessor of Semiconductor Physics, Johannes Kepler University LinzVerified email at jku.at