| Compact curved-edge displacement sensor-embedded spindle system for machining process monitoring J Kim, S Lee, H Chun, CB Lee Journal of Manufacturing Processes 64, 1255-1260, 2021 | 13 | 2021 |
| Pressure-fed mechanism to compensate for motions and dynamic characteristics of compliant nanopositioning stages H Chun, JM Han, L Wright, A Elwany, H Villarraga-Gómez, CB Lee Precision Engineering 63, 33-40, 2020 | 10 | 2020 |
| A review: additive manufacturing of flexure mechanism for nanopositioning system H Chun, X Guo, JS Kim, CB Lee The International Journal of Advanced Manufacturing Technology 110 (3), 681-703, 2020 | 7 | 2020 |
| Characterization of thermally stable compliant structures with internal fluidic channels H Chun, GH Kim, H Villarraga-Gómez, HY Kim, A Elwany, CB Lee Precision Engineering 66, 201-208, 2020 | 5 | 2020 |
| Three-axis displacement sensor-integrated spindle system for carbon fiber-reinforced plastic (CFRP) machining process monitoring J Kim, H Chun, CB Lee Journal of Manufacturing Processes 77, 361-368, 2022 | 4 | 2022 |
| Enhancement of knife-edge interferometry for edge topography characterization Z Wang, H Chun, CB Lee Review of Scientific Instruments 92 (12), 125101, 2021 | 4 | 2021 |
| Non-Destructive Surface Profiling and Inspection by Using a Single Unit Magneto-Eddy Current Sensor J Kim, H Chun, CB Lee Journal of Manufacturing Science and Engineering, 1-10, 2022 | 2 | 2022 |
| Curved-edge diffractive fringe pattern analysis for wafer edge metrology and inspection K Lu, Z Wang, H Chun, C Lee Metrology, Inspection, and Process Control XXXVII 12496, 105-106, 2023 | 1 | 2023 |
| CFRP Milling and Drilling Process Monitoring by Using a Spindle-Integrated Three Axis Force Sensor J Kim, H Chun, CB Lee International Manufacturing Science and Engineering Conference 85802 …, 2022 | 1 | 2022 |
| Damping characteristics of fluidic pressure-fed mechanism for positioning applications H Chun, J Kim, HY Kim, CB Lee Journal of Dynamic Systems, Measurement, and Control 143 (11), 2021 | 1 | 2021 |
| A monolithic linear motion platform driven by a piezoelectric and fluidic pressure-fed dual mechanism H Chun, J Kim, CB Lee, HY Kim Review of Scientific Instruments 92 (10), 105002, 2021 | 1 | 2021 |
| Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation C Han, H Chun, J Lee, F Zhou, H Yun, CB Lee, M Jun Journal of Manufacturing Science and Engineering, 1-34, 2024 | | 2024 |
| Wafer particle inspection technique using computer vision based on a color space transform model H Chun, J Wang, J Kim, CB Lee The International Journal of Advanced Manufacturing Technology 127 (11-12 …, 2023 | | 2023 |
| A differentially amplified Hall effect displacement sensor for positioning control of a long-range flexure stage W Park, H Chun, P Nguyen, C Lee Review of Scientific Instruments 94 (7), 2023 | | 2023 |
| Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection C Han, H Chun, CB Lee, MBG Jun International Manufacturing Science and Engineering Conference 87240 …, 2023 | | 2023 |
| Geometric part error and material property profile separation technique of the additively manufactured and post-processed rods J Kim, H Chun, P Nguyen, B Li-Jung Tai, C Lee Review of Scientific Instruments 94 (3), 035109, 2023 | | 2023 |
| In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface H Chun, W Park, J Kim, CB Lee Journal of Manufacturing and Materials Processing 6 (5), 97, 2022 | | 2022 |
| In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface H Chun, J Kim, J Nam, S Ju, CB Lee International Manufacturing Science and Engineering Conference 85802 …, 2022 | | 2022 |
| Dynamics and Controls of Fluidic Pressure-Fed Mechanism (FPFM) of Nanopositioning System H Chun | | 2020 |
