Wear behaviour of AE42+ 20% saffil Mg-MMC AK Mondal, BSSC Rao, S Kumar
Tribology International 40 (2), 290-296, 2007
71 2007 Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints BSSC Rao, J Weng, L Shen, TK Lee, KY Zeng
Microelectronic engineering 87 (11), 2416-2422, 2010
66 2010 The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy VL Niranjani, BSSC Rao, R Sarkar, SV Kamat
Journal of alloys and compounds 542, 136-141, 2012
43 2012 Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites VL Niranjani, BSSC Rao, V Singh, SV Kamat
Materials Science and Engineering: A 529, 257-264, 2011
43 2011 The effect of high energy mechanochemical processing on the microstructure, piezoelectric, ferroelectric and mechanical properties of PLZT ceramics AR James, BSSC Rao, M Pathak, SV Kamat, J Subrahmanyam
Nanotechnology 19 (19), 195201, 2008
32 2008 The effect of mixed mode I/III loading on the fracture toughness of Timetal 834 titanium alloy BSSC Rao, M Srinivas, SV Kamat
Materials Science and Engineering: A 476 (1-2), 162-168, 2008
26 2008 The effect of volume fraction of primary α phase on fracture toughness behaviour of Timetal 834 titanium alloy under mode I and mixed mode I/III loading BSSC Rao, M Srinivas, SV Kamat
Materials Science and Engineering: A 520 (1-2), 29-35, 2009
22 2009 Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders BSSC Rao, KM Kumar, V Kripesh, KY Zeng
Materials Science and Engineering: A 528 (12), 4166-4172, 2011
19 2011 Water-based gelcasting of lead zirconate titanate and evaluation of mechanical properties of the gelcast samples S Roy, BSSC Rao, J Subrahmanyam
Scripta Materialia 57 (9), 817-820, 2007
15 2007 Effect of temperature on fracture toughness of Timetal 834 titanium alloy under mode I and mixed mode I/III loading BSS Chandra Rao, M Srinivas, SV Kamat
Metallurgical and Materials Transactions A 39, 1340-1349, 2008
13 2008 Creep behaviour of SAC387 lead free solder alloy reinforced with single walled carbon nanotubes VL Niranjani, V Singh, BSS Chandra Rao, SV Kamat
Transactions of the Indian Institute of Metals 68, 311-317, 2015
10 2015 Evaluation of mechanical properties of gelcast lead zirconate titanate disks sintered at different temperatures S Roy, BSSC Rao, J Subrahmanyam
Scripta Materialia 57 (11), 1024-1027, 2007
10 2007 Structural, thermal, electromechanical and mechanical property studies on (pb0. 93la0. 07)(zr0. 60ti0. 40) o3 ceramics synthesized by a high energy mechanochemical milling process AR James, BSSC Rao, SV Kamat, J Subrahmanyam, K Srinivas, ...
Smart materials and structures 17 (3), 035020, 2008
9 2008 Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders BSSC Rao, KM Kumar, KY Zeng, AAO Tay, V Kripesh
2009 11th Electronics Packaging Technology Conference, 272-277, 2009
7 2009 Effect of gold addition on the microstructure and mechanical properties of Sn–3.8 Ag–0.7 Cu lead-free solder alloy VL Niranjani, P Venkateswarlu, V Singh, BSS Chandra Rao, SV Kamat
Transactions of the Indian Institute of Metals 71, 1497-1505, 2018
6 2018 Under-Bump Metallization Contact Resistance ( ) Characterization at 10- Polymer Passivation Opening P Lianto, KJ Chui, B Bhushan, HMC Chua, L Tang, BSSC Rao, X Wang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017
5 2017 One-step TSV process development for 4-layer wafer stacked DRAM M Kawano, XY Wang, Q Ren, WL Loh, BSSC Rao, KJ Chui
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 673-679, 2021
4 2021 Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints BSSC Rao, DM Fernandez, V Kripesh, KY Zeng
2010 12th Electronics Packaging Technology Conference, 423-428, 2010
4 2010 Wafer Stacked Wide I/O DRAM with One-step TSV Technology M Kawano, XY Wang, Q Ren, WL Loh, BSSC Rao, KJ Chui, T Kawagoe, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 143-148, 2022
3 2022 Determination of tensile properties of lead-free solder joints using nanoindentation BSSC Rao, KY Zeng, V Kripesh
2010 12th Electronics Packaging Technology Conference, 309-314, 2010
3 2010