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Johann Knechtel
Johann Knechtel
New York University, Abu Dhabi
Bestätigte E-Mail-Adresse bei nyu.edu - Startseite
Titel
Zitiert von
Zitiert von
Jahr
Assembling 2-D blocks into 3-D chips
J Knechtel, IL Markov, J Lienig
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012
472012
Obfuscating the interconnects: Low-cost and resilient full-chip layout camouflaging
S Patnaik, M Ashraf, J Knechtel, O Sinanoglu
2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 41-48, 2017
432017
Advancing hardware security using polymorphic and stochastic spin-hall effect devices
S Patnaik, N Rangarajan, J Knechtel, O Sinanoglu, S Rakheja
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 97-102, 2018
392018
Large-scale 3D chips: Challenges and solutions for design automation, testing, and trustworthy integration
J Knechtel, O Sinanoglu, IAM Elfadel, J Lienig, CCN Sze
IPSJ Transactions on System LSI Design Methodology 10, 45-62, 2017
352017
Concerted wire lifting: Enabling secure and cost-effective split manufacturing
S Patnaik, M Ashraf, H Li, J Knechtel, O Sinanoglu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021
302021
Rethinking split manufacturing: An information-theoretic approach with secure layout techniques
A Sengupta, S Patnaik, J Knechtel, M Ashraf, S Garg, O Sinanoglu
2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 329-326, 2017
302017
Planning Massive Interconnects in 3D Chips
J Knechtel, E Young, J Lienig
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions …, 2015
302015
Raise your game for split manufacturing: Restoring the true functionality through BEOL
S Patnaik, M Ashraf, J Knechtel, O Sinanoglu
2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC), 1-6, 2018
252018
Physical Design for 3D Integrated Circuits
A Todri-Sanial, CS Tan
CRC Press, 2016
202016
DNA-assisted oligomerization of pore-forming toxin monomers into precisely-controlled protein channels
A Henning-Knechtel, J Knechtel, M Magzoub
Nucleic acids research 45 (21), 12057-12068, 2017
192017
Opening the doors to dynamic camouflaging: Harnessing the power of polymorphic devices
N Rangarajan, S Patnaik, J Knechtel, R Karri, O Sinanoglu, S Rakheja
IEEE Transactions on Emerging Topics in Computing, 2020
182020
Attacking split manufacturing from a deep learning perspective
H Li, S Patnaik, A Sengupta, H Yang, J Knechtel, B Yu, EFY Young, ...
2019 56th ACM/IEEE Design Automation Conference (DAC), 1-6, 2019
172019
3D stacked chips
A Elfadel, G Fettweis
Springer, 2016
172016
Multiobjective optimization of deadspace, a critical resource for 3D-IC integration
J Knechtel, IL Markov, J Lienig, M Thiele
Proceedings of the International Conference on Computer-Aided Design, 705-712, 2012
172012
Hardware security for and beyond CMOS technology: an overview on fundamentals, applications, and challenges
J Knechtel
Proceedings of the 2020 International Symposium on Physical Design, 75-86, 2020
162020
On mitigation of side-channel attacks in 3D ICs: Decorrelating thermal patterns from power and activity
J Knechtel, O Sinanoglu
2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC), 1-6, 2017
162017
Protect your chip design intellectual property: An overview
J Knechtel, S Patnaik, O Sinanoglu
Proceedings of the International Conference on Omni-Layer Intelligent …, 2019
152019
Physical design automation for 3D chip stacks: challenges and solutions
J Knechtel, J Lienig
Proceedings of the 2016 on International Symposium on Physical Design, 3-10, 2016
152016
Spin-orbit torque devices for hardware security: From deterministic to probabilistic regime
S Patnaik, N Rangarajan, J Knechtel, O Sinanoglu, S Rakheja
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019
142019
Best of both worlds: Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs
S Patnaik, M Ashraf, O Sinanoglu, J Knechtel
2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2018
142018
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