| Obfuscating the interconnects: Low-cost and resilient full-chip layout camouflaging S Patnaik, M Ashraf, J Knechtel, O Sinanoglu 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 41-48, 2017 | 53 | 2017 |
| Assembling 2D blocks into 3D chips J Knechtel, IL Markov, J Lienig Proceedings of the 2011 international symposium on Physical design, 81-88, 2011 | 48 | 2011 |
| Advancing hardware security using polymorphic and stochastic spin-hall effect devices S Patnaik, N Rangarajan, J Knechtel, O Sinanoglu, S Rakheja 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 97-102, 2018 | 46 | 2018 |
| Large-scale 3D chips: Challenges and solutions for design automation, testing, and trustworthy integration J Knechtel, O Sinanoglu, IAM Elfadel, J Lienig, CCN Sze IPSJ Transactions on System LSI Design Methodology 10, 45-62, 2017 | 40 | 2017 |
| Concerted wire lifting: Enabling secure and cost-effective split manufacturing S Patnaik, M Ashraf, H Li, J Knechtel, O Sinanoglu IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 33 | 2021 |
| Rethinking split manufacturing: An information-theoretic approach with secure layout techniques A Sengupta, S Patnaik, J Knechtel, M Ashraf, S Garg, O Sinanoglu 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 329-326, 2017 | 32 | 2017 |
| Planning Massive Interconnects in 3D Chips J Knechtel, E Young, J Lienig Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions …, 2015 | 30 | 2015 |
| Opening the doors to dynamic camouflaging: Harnessing the power of polymorphic devices N Rangarajan, S Patnaik, J Knechtel, R Karri, O Sinanoglu, S Rakheja IEEE Transactions on Emerging Topics in Computing, 2020 | 27 | 2020 |
| Raise your game for split manufacturing: Restoring the true functionality through BEOL S Patnaik, M Ashraf, J Knechtel, O Sinanoglu Proceedings of the 55th Annual Design Automation Conference, 1-6, 2018 | 27 | 2018 |
| Protect your chip design intellectual property: An overview J Knechtel, S Patnaik, O Sinanoglu Proceedings of the International Conference on Omni-Layer Intelligent …, 2019 | 25 | 2019 |
| DNA-assisted oligomerization of pore-forming toxin monomers into precisely-controlled protein channels A Henning-Knechtel, J Knechtel, M Magzoub Nucleic acids research 45 (21), 12057-12068, 2017 | 25 | 2017 |
| Attacking split manufacturing from a deep learning perspective H Li, S Patnaik, A Sengupta, H Yang, J Knechtel, B Yu, EFY Young, ... Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019 | 22 | 2019 |
| Physical Design for 3D Integrated Circuits A Todri-Sanial, CS Tan CRC Press, 2016 | 22 | 2016 |
| UNSAIL: Thwarting Oracle-Less Machine Learning Attacks on Logic Locking L Alrahis, S Patnaik, J Knechtel, H Saleh, B Mohammad, M Al-Qutayri, ... IEEE Transactions on Information Forensics and Security 16, 2508-2523, 2021 | 21 | 2021 |
| Towards secure composition of integrated circuits and electronic systems: On the role of EDA J Knechtel, EB Kavun, F Regazzoni, A Heuser, A Chattopadhyay, ... DATE, 2020 | 21 | 2020 |
| On mitigation of side-channel attacks in 3D ICs: Decorrelating thermal patterns from power and activity J Knechtel, O Sinanoglu Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017 | 21 | 2017 |
| 3D stacked chips A Elfadel, G Fettweis Springer, 2016 | 20 | 2016 |
| Hardware security for and beyond CMOS technology: an overview on fundamentals, applications, and challenges J Knechtel Proceedings of the 2020 International Symposium on Physical Design, 75-86, 2020 | 19 | 2020 |
| Physical design automation for 3D chip stacks: Challenges and solutions J Knechtel, J Lienig Proceedings of the 2016 on International Symposium on Physical Design, 3-10, 2016 | 18 | 2016 |
| Multiobjective optimization of deadspace, a critical resource for 3D-IC integration J Knechtel, IL Markov, J Lienig, M Thiele Proceedings of the International Conference on Computer-Aided Design, 705-712, 2012 | 18 | 2012 |
Ozgur SinanogluProfessor of Electrical and Computer Engineering, New York University Abu DhabiVerified email at nyu.edu
