Johann Knechtel
Johann Knechtel
New York University, Abu Dhabi
Verified email at nyu.edu - Homepage
Title
Cited by
Cited by
Year
Assembling 2-D blocks into 3-D chips
J Knechtel, IL Markov, J Lienig
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012
462012
Obfuscating the interconnects: Low-cost and resilient full-chip layout camouflaging
S Patnaik, M Ashraf, J Knechtel, O Sinanoglu
2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 41-48, 2017
332017
Large-scale 3D chips: Challenges and solutions for design automation, testing, and trustworthy integration
J Knechtel, O Sinanoglu, IAM Elfadel, J Lienig, CCN Sze
IPSJ Transactions on System LSI Design Methodology 10, 45-62, 2017
292017
Advancing hardware security using polymorphic and stochastic spin-hall effect devices
S Patnaik, N Rangarajan, J Knechtel, O Sinanoglu, S Rakheja
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 97-102, 2018
272018
Planning Massive Interconnects in 3D Chips
J Knechtel, E Young, J Lienig
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions …, 2015
272015
Concerted wire lifting: Enabling secure and cost-effective split manufacturing
S Patnaik, M Ashraf, H Li, J Knechtel, O Sinanoglu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2021
252021
Rethinking split manufacturing: An information-theoretic approach with secure layout techniques
A Sengupta, S Patnaik, J Knechtel, M Ashraf, S Garg, O Sinanoglu
2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 329-326, 2017
252017
Raise your game for split manufacturing: Restoring the true functionality through BEOL
S Patnaik, M Ashraf, J Knechtel, O Sinanoglu
2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC), 1-6, 2018
222018
Physical Design for 3D Integrated Circuits
A Todri-Sanial, CS Tan
CRC Press, 2016
202016
3D stacked chips
A Elfadel, G Fettweis
Springer, 2016
202016
Multiobjective optimization of deadspace, a critical resource for 3D-IC integration
J Knechtel, IL Markov, J Lienig, M Thiele
Proceedings of the International Conference on Computer-Aided Design, 705-712, 2012
172012
Attacking split manufacturing from a deep learning perspective
H Li, S Patnaik, A Sengupta, H Yang, J Knechtel, B Yu, EFY Young, ...
2019 56th ACM/IEEE Design Automation Conference (DAC), 1-6, 2019
152019
Protect your chip design intellectual property: An overview
J Knechtel, S Patnaik, O Sinanoglu
Proceedings of the International Conference on Omni-Layer Intelligent …, 2019
142019
On mitigation of side-channel attacks in 3D ICs: Decorrelating thermal patterns from power and activity
J Knechtel, O Sinanoglu
2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC), 1-6, 2017
142017
DNA-assisted oligomerization of pore-forming toxin monomers into precisely-controlled protein channels
A Henning-Knechtel, J Knechtel, M Magzoub
Nucleic acids research 45 (21), 12057-12068, 2017
132017
Spin-orbit torque devices for hardware security: From deterministic to probabilistic regime
S Patnaik, N Rangarajan, J Knechtel, O Sinanoglu, S Rakheja
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019
122019
Investigating modern layout representations for improved 3D design automation
R Fischbach, J Lienig, J Knechtel
Proceedings of the 21st edition of the great lakes symposium on Great lakes …, 2011
122011
Opening the doors to dynamic camouflaging: Harnessing the power of polymorphic devices
N Rangarajan, S Patnaik, J Knechtel, R Karri, O Sinanoglu, S Rakheja
IEEE Transactions on Emerging Topics in Computing, 2020
112020
Best of both worlds: Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs
S Patnaik, M Ashraf, O Sinanoglu, J Knechtel
2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2018
112018
Physical design automation for 3D chip stacks: challenges and solutions
J Knechtel, J Lienig
Proceedings of the 2016 on International Symposium on Physical Design, 3-10, 2016
112016
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Articles 1–20