| Geometrically designing the kinematic behavior of catalytic nanomotors JG Gibbs, S Kothari, D Saintillan, YP Zhao Nano letters 11 (6), 2543-2550, 2011 | 86 | 2011 |
| Stacked die architectures with improved thermal management F Eid, S Kothari, CM Jha, JM Swan, MJ Baker, SM Liff, TL Sounart, ... US Patent App. 15/866,793, 2019 | 12 | 2019 |
| Embedded air core inductors for integrated circuit package substrates with thermal conductor T Fitzgerald, W Lambert, S Kothari, P Sullhan, A Antoniswamy US Patent 9,515,003, 2016 | 10 | 2016 |
| Compact thermal modeling methodology for active and thermal bumps in 3D microelectronic packages A Choudhury, S Kothari, N Mahanta, H Dhavaleswarapu, JY Chang International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 8 | 2015 |
| Challenges and opportunities in thermal management of multi-chip packages HK Dhavaleswarapu, CM Jha, SF Smith, S Kothari, B Bicen, SK Saha, ... International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 3 | 2015 |
| Economics of biomass-derived alcohol application in fuel cells SP Kothari, PS Patel Energy Prog.;(United States) 2 (4), 1982 | 3 | 1982 |
| Thermal management solutions using self-healing polymeric thermal interface materials A Saha, S Gong, S Kothari US Patent 11,551,997, 2023 | 2 | 2023 |
| Customized integrated heat spreader design with targeted doping for multi-chip packages S Kothari, A Antoniswamy US Patent App. 16/794,815, 2021 | 2 | 2021 |
| Sintered heat spreaders with inserts W Hu, AR Antoniswamy, TJ Fitzgerald, NP Patel, S Jain, ZZ Tang, ... US Patent App. 15/767,126, 2019 | 2 | 2019 |
| Numerical study with experimental validation of thermal coupling phenomena with flip-chip assembled test dies on PCB T Nowak, S Merbold, C Egbers, R Schacht 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 1 | 2018 |
| Semiconductor device stack-up with bulk substrate material to mitigate hot spots S Kothari, CM Jha, W Tang, R Sankman, X Brun, P Tadayon US Patent 11,756,860, 2023 | | 2023 |
| Semiconductor device stack-up with bulk substrate material to mitigate hot spots S Kothari, CM Jha, W Tang, R Sankman, X Brun, P Tadayon US Patent App. 18/089,537, 2023 | | 2023 |
| Multi-surface heat sink suitable for multi-chip packages S Kothari, S Ahuja, S Smith, J Smalley, FGL Sanchez, MLB Velazquez, ... US Patent 11,495,518, 2022 | | 2022 |
| Sloped metal features for cooling hotspots in stacked-die packages Z Wan, CP Chiu, P Tadayon, JF Walczyk, CM Jha, W Tang, S Kothari, ... US Patent 11,398,414, 2022 | | 2022 |
| Stacked die architectures with improved thermal management F Eid, S Kothari, CM Jha, JM Swan, MJ Baker, SM Liff, TL Sounart, ... US Patent App. 17/399,882, 2021 | | 2021 |
| David Saintillan GJLG Fellowship Journal of Fluid Mechanics 914, A22, 2021 | | 2021 |
| Multi-piece heat spreader for multi-chip package S Ahuja, JY Chang, P Geng, S Kothari, FGL Sanchez US Patent App. 16/642,617, 2020 | | 2020 |
| Semiconductor device stack-up with bulk substrate material to mitigate hot spot challenges S Kothari US Patent App. AB9,913, 2019 | | 2019 |
| HEAT Analytical Methodology and Tool to enable power-thermal co-optimization of Silicon microarchitecture and SoC design S Kothari Design, Test and Technology Conference, DTTC 2019, 2019 | | 2019 |
| Reviewer’s Recognition M Abou Dbai, J Ahn, K Akyuzlu, VA Avincola, H Anglart, A Arastu, ... Journal of Nuclear Engineering and Radiation Science 5, 010202-1, 2019 | | 2019 |
Aravindha R AntoniswamyIntel Corporation, University of Texas at AustinBestätigte E-Mail-Adresse bei intel.com
